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Machine translation
1. (WO2000027585) METHOD AND APPARATUS FOR CONDITIONING A POLISHING PAD USED IN CHEMICAL MECHANICAL PLANARIZATION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2000/027585    International Application No.:    PCT/US1999/024841
Publication Date: 18.05.2000 International Filing Date: 25.10.1999
Chapter 2 Demand Filed:    07.06.2000    
IPC:
B24B 53/00 (2006.01), B24B 49/16 (2006.01), B24B 53/007 (2006.01), B24B 53/017 (2012.01), B24B 53/12 (2006.01), B24B 55/06 (2006.01), B24D 5/02 (2006.01), H01L 21/304 (2006.01)
Applicants: LAM RESEARCH CORPORATION [US/US]; 4650 Cushing Parkway Fremont, CA 94538 (US) (For All Designated States Except US).
LABUNSKY, Michael [US/US]; (US) (For US Only).
HUYNH, Tac [US/US]; (US) (For US Only).
MEYER, Anthony [US/US]; (US) (For US Only).
NAGENGAST, Andrew, J. [US/US]; (US) (For US Only).
TRAVIS, Glenn, W. [US/US]; (US) (For US Only)
Inventors: LABUNSKY, Michael; (US).
HUYNH, Tac; (US).
MEYER, Anthony; (US).
NAGENGAST, Andrew, J.; (US).
TRAVIS, Glenn, W.; (US)
Agent: GENIN, Kent, E.; Brinks Hofer Gilson & Lione P.O. Box 10087 Chicago, IL 60610 (US)
Priority Data:
09/188,779 09.11.1998 US
Title (EN) METHOD AND APPARATUS FOR CONDITIONING A POLISHING PAD USED IN CHEMICAL MECHANICAL PLANARIZATION
(FR) PROCEDE ET APPAREIL CONÇUS POUR LE TRAITEMENT D'UN TAMPON A POLIR UTILISE DANS LA PLANARISATION CHIMICO-MECANIQUE
Abstract: front page image
(EN)A method and apparatus for conditioning a polishing pad is described. The method includes steps of moving a cylindrical roller having an abrasive substance affixed to it against a moving polishing pad. The roller may be passively rotated by contact with the polishing pad, or actively reciprocated, while maintaining a pressure against the polishing pad. The apparatus includes a cylindrical roller attached to one or more pressure application devices mechanically connected to the roller.
(FR)L'invention concerne un procédé et un appareil conçus pour le traitement d'un tampon à polir. Le procédé consiste à faire se déplacer un rouleau cylindrique ayant une substance abrasive sur sa surface contre le tampon à polir mobile. Le rouleau peut être passivement mis en rotation du fait de son entrée en contact avec le tampon à polir, ou activement déplacé dans un mouvement de va-et-vient, une pression étant maintenue contre le tampon à polir. L'appareil comporte un rouleau cylindrique fixé à un ou à plusieurs dispositif(s) d'application de pression, connecté(s) mécaniquement au rouleau.
Designated States: AE, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CR, CU, CZ, DE, DK, DM, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, TZ, UA, UG, US, UZ, VN, YU, ZA, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, SD, SL, SZ, TZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)