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Machine translation
1. (WO2000027172) FOLDABLE CIRCUITS AND METHOD OF MAKING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2000/027172    International Application No.:    PCT/US1999/025713
Publication Date: 11.05.2000 International Filing Date: 29.10.1999
Chapter 2 Demand Filed:    17.05.2000    
IPC:
H05K 1/00 (2006.01), H05K 1/05 (2006.01), H05K 3/00 (2006.01), H05K 3/28 (2006.01)
Applicants: TRUSTEES OF PRINCETON UNIVERSITY [US/US]; P.O. Box 36 Princeton, NJ 08544-0036 (US) (For All Designated States Except US).
WAGNER, Sigurd [--/US]; (US) (For US Only).
SUO, Zhigang [--/US]; (US) (For US Only).
MA, Eugene, Yi-Shan [--/US]; (US) (For US Only)
Inventors: WAGNER, Sigurd; (US).
SUO, Zhigang; (US).
MA, Eugene, Yi-Shan; (US)
Agent: FRISCIA, Michael, R.; Wolff & Samson 5 Becker Farm Road Roseland, NJ 07068-1776 (US)
Priority Data:
60/106,138 29.10.1998 US
Title (EN) FOLDABLE CIRCUITS AND METHOD OF MAKING SAME
(FR) CIRCUITS PLIABLES ET LEUR PROCEDE DE REALISATION
Abstract: front page image
(EN)A foldable electronic circuit is manufactured on a flexible substrate (14), such as a steel foil or a plastic foil, and the circuit (12) is encapsulated with layer (10) of appropriate thickness. The circuit thereby lies in the neutral plane of the composite substrate and encapsulated circuit structure. When the composite structure is bent or flexed, minimal stress is exerted on the circuit, as the circuit is positioned in the neutral plane. Generally, the closer the circuit is located to the mechanical center of the composite structure, i.e. closer to the neutral plane, the more flexible the circuit structure is.
(FR)Circuit électronique pliable, fabriqué sur un substrat flexible (14) tel qu'une feuille d'acier ou de matière plastique, où le circuit (12) est encapsulé par la couche (10) d'épaisseur appropriée. Le circuit repose sur le plan moyen du substrat composite et de la structure du circuit piégé. Lorsque la structure composite est pliée ou fléchie, la contrainte s'exerçant sur le circuit est minimale, étant donné que le circuit se trouve dans le plan moyen. D'une manière générale, plus le circuit est proche du centre mécanique de la structure composite, c'est-à-dire proche du plan moyen, plus la structure du circuit est flexible.
Designated States: AE, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CU, CZ, DE, DK, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, UA, UG, US, UZ, VN, YU, ZA, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, SD, SL, SZ, TZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)