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1. WO2000026318 - ADHESIVE COMPOSITION

Publication Number WO/2000/026318
Publication Date 11.05.2000
International Application No. PCT/JP1999/005896
International Filing Date 26.10.1999
IPC
C09J 109/02 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
109Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
02Copolymers with acrylonitrile
C09J 163/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
H05K 1/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
H05K 3/38 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
38Improvement of the adhesion between the insulating substrate and the metal
CPC
C08L 2666/02
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
2666Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
C08L 2666/14
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
2666Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
14Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
C08L 2666/28
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
2666Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
28Non-macromolecular organic substances
C09J 109/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
109Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
02Copolymers with acrylonitrile
C09J 163/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
163Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
H05K 1/0393
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0393Flexible materials
Applicants
  • MITSUI CHEMICALS INC. [JP]/[JP] (AllExceptUS)
  • YAMASAKI, Susumu [JP]/[JP] (UsOnly)
  • SUETSUGU, Toshio [JP]/[JP] (UsOnly)
  • SOEJIMA, Wataru [JP]/[JP] (UsOnly)
  • ISHIGURO, Masaharu [JP]/[JP] (UsOnly)
Inventors
  • YAMASAKI, Susumu
  • SUETSUGU, Toshio
  • SOEJIMA, Wataru
  • ISHIGURO, Masaharu
Agents
  • NAKAJIMA, Shigemitsu
Priority Data
10/30928030.10.1998JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ADHESIVE COMPOSITION
(FR) COMPOSITION ADHESIVE
Abstract
(EN)
An adhesive composition suitable for printed circuit boards, particularly flexible ones, comprising (1) a specific phosphate ester represented by general formula (I), (2) an aromatic compound bearing a phenolic hydroxyl group and having a softening point of 60 to 200 °C, (3) an epoxy resin, and (4) a carboxylated nitrile/butadiene rubber in such proportions by weight as to satisfy the relationship: 0 < component (2)/(component (3) + component (4)) < 1; and flexible printed circuit boards made by using the composition.
(FR)
L'invention se rapporte à une composition adhésive destinée à des cartes de circuits imprimés, notamment à des cartes souples. Cette composition contient (1) un ester phosphate spécifique représenté par la formule (I), (2) un composé aromatique portant un groupe hydroxyle phénolique et possédant une température de ramollissement comprise entre 60 et 200 °C, (3) une résine époxy et (4) un caoutchouc de nitrile-butadiène carboxylé, dans des proportions pondérales telles que la relation suivante est satisfaite: 0 < composant(2)/(composant (3) + composant (4)) < 1. L'invention se rapporte également à des cartes de circuits imprimés fabriquées avec ladite composition.
Also published as
US09582707
Latest bibliographic data on file with the International Bureau