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Machine translation
1. (WO2000026318) ADHESIVE COMPOSITION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2000/026318    International Application No.:    PCT/JP1999/005896
Publication Date: 11.05.2000 International Filing Date: 26.10.1999
IPC:
C09J 109/02 (2006.01), C09J 163/00 (2006.01), H05K 1/00 (2006.01), H05K 3/38 (2006.01)
Applicants: MITSUI CHEMICALS INC. [JP/JP]; 2-5, Kasumigaseki 3-chome Chiyoda-ku, Tokyo 100-6070 (JP) (For All Designated States Except US).
YAMASAKI, Susumu [JP/JP]; (JP) (For US Only).
SUETSUGU, Toshio [JP/JP]; (JP) (For US Only).
SOEJIMA, Wataru [JP/JP]; (JP) (For US Only).
ISHIGURO, Masaharu [JP/JP]; (JP) (For US Only)
Inventors: YAMASAKI, Susumu; (JP).
SUETSUGU, Toshio; (JP).
SOEJIMA, Wataru; (JP).
ISHIGURO, Masaharu; (JP)
Agent: NAKAJIMA, Shigemitsu; Nichiyo Building 3rd floor 11-12, Kanda Mitoshiro-cho Chiyoda-ku Tokyo 101-0053 (JP)
Priority Data:
10/309280 30.10.1998 JP
Title (EN) ADHESIVE COMPOSITION
(FR) COMPOSITION ADHESIVE
Abstract: front page image
(EN)An adhesive composition suitable for printed circuit boards, particularly flexible ones, comprising (1) a specific phosphate ester represented by general formula (I), (2) an aromatic compound bearing a phenolic hydroxyl group and having a softening point of 60 to 200 °C, (3) an epoxy resin, and (4) a carboxylated nitrile/butadiene rubber in such proportions by weight as to satisfy the relationship: 0 < component (2)/(component (3) + component (4)) < 1; and flexible printed circuit boards made by using the composition.
(FR)L'invention se rapporte à une composition adhésive destinée à des cartes de circuits imprimés, notamment à des cartes souples. Cette composition contient (1) un ester phosphate spécifique représenté par la formule (I), (2) un composé aromatique portant un groupe hydroxyle phénolique et possédant une température de ramollissement comprise entre 60 et 200 °C, (3) une résine époxy et (4) un caoutchouc de nitrile-butadiène carboxylé, dans des proportions pondérales telles que la relation suivante est satisfaite: 0 < composant(2)/(composant (3) + composant (4)) < 1. L'invention se rapporte également à des cartes de circuits imprimés fabriquées avec ladite composition.
Designated States: JP, US.
European Patent Office (DE, FR, GB).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)