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Machine translation
1. (WO2000025984) CHEMICAL MECHANICAL POLISHING A SUBSTRATE HAVING A FILLER LAYER AND A STOP LAYER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2000/025984    International Application No.:    PCT/US1999/025183
Publication Date: 11.05.2000 International Filing Date: 26.10.1999
Chapter 2 Demand Filed:    31.05.2000    
IPC:
B24B 37/04 (2012.01), H01L 21/3105 (2006.01), H01L 21/321 (2006.01), H01L 21/768 (2006.01)
Applicants: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, CA 95024 (US)
Inventors: JIN, Raymond, R.; (US).
LI, Shijian; (US).
REDEKER, Fred, C.; (US).
OSTERHELD, Thomas, H.; (US)
Agent: BERNADICOU, Michael, A.; Blakely, Sokoloff, Taylor & Zafman LLP 7th Floor 12400 Wilshire Boulevard Los Angeles, CA 90025 (US)
Priority Data:
09/184,805 02.11.1998 US
Title (EN) CHEMICAL MECHANICAL POLISHING A SUBSTRATE HAVING A FILLER LAYER AND A STOP LAYER
(FR) POLISSAGE CHIMIO-MECANIQUE POUR SUBSTRAT COMPORTANT UNE COUCHE DE REMPLISSAGE ET UNE COUCHE D'ARRET
Abstract: front page image
(EN)A substrate (10) is chemical mechanical polished with a high-selectivity slurry until the stop layer (14) is at least partially exposed, and then the substrate (10) is polished with a low-selectivity slurry until the stop layer (14) is completely exposed.
(FR)On polit un substrat (10) par un procédé chimio-mécanique avec une pâte très sélective jusqu'à exposer au moins partiellement la couche d'arrêt (14), puis on le polit avec une pâte peu sélective jusqu'à exposer entièrement ladite couche (14).
Designated States: JP, KR, SG.
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE).
Publication Language: English (EN)
Filing Language: English (EN)