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Machine translation
1. (WO2000025562) STACKED CIRCUIT BOARD ASSEMBLY ADAPTED FOR HEAT DISSIPATION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2000/025562    International Application No.:    PCT/US1999/025185
Publication Date: 04.05.2000 International Filing Date: 27.10.1999
Chapter 2 Demand Filed:    26.05.2000    
IPC:
H05K 1/14 (2006.01), H05K 7/20 (2006.01)
Applicants: UNISYS CORPORATION [US/US]; Township Line and Union Meeting Roads P.O. Box 500 Blue Bell, PA 19424-0001 (US)
Inventors: SMITH, Grant, M.; (US).
TAMARKIN, Vladimir, K.; (US)
Agent: STARR, Mark, T.; Unisys Corporation Township Line and Union Meeting Roads P.O. Box 500 Blue Bell, PA 19424-0001 (US)
Priority Data:
09/181,448 28.10.1998 US
Title (EN) STACKED CIRCUIT BOARD ASSEMBLY ADAPTED FOR HEAT DISSIPATION
(FR) ENSEMBLE CARTES A CIRCUIT IMPRIME EMPILEES ADAPTE POUR LA DISSIPATION THERMIQUE
Abstract: front page image
(EN)An apparatus is provided for dissipating heat from a stacked circuit board assembly. The apparatus includes circuit boards that are oriented in spaced planes that extend substantially parallel to one another. A heat transfer means connected to the circuit boards transfers heat between the circuit boards. A heat dissipation means connected to at least one of the circuit boards dissipates at least a portion of the transferred heat.
(FR)L'invention concerne un appareil permettant de dissiper la chaleur d'un ensemble cartes à circuit imprimé superposées. L'appareil comprend des cartes à circuit imprimé orientées sur des plans espacés qui sont sensiblement parallèles les uns aux autres. Un système de transfert de chaleur, connecté aux cartes à circuit imprimé, transfère la chaleur entre les cartes à circuit ; un système de dissipation thermique connecté à au moins une carte à circuit dissipe une partie au moins de la chaleur transférée.
Designated States: BR, CA, JP.
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE).
Publication Language: English (EN)
Filing Language: English (EN)