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1. WO2000013870 - METHOD AND DEVICE FOR CUTTING AND MIRROR FINISHING SINGLE CRYSTAL SILICON CARBIDE

Publication Number WO/2000/013870
Publication Date 16.03.2000
International Application No. PCT/JP1999/004729
International Filing Date 01.09.1999
IPC
B24B 27/06 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
27Other grinding machines or devices
06Grinders for cutting-off
B24B 53/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
53Devices or means for dressing or conditioning abrasive surfaces
B24D 5/12 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING OR SHARPENING
5Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
12Cut-off wheels
B28D 5/02 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
28WORKING CEMENT, CLAY, OR STONE
DWORKING STONE OR STONE-LIKE MATERIALS
5Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
02by rotary tools, e.g. drills
CPC
B24B 27/0658
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
27Other grinding machines or devices
06Grinders for cutting-off
0658for cutting workpieces while they are turning about their longitudinal axis
B24B 53/001
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
53Devices or means for dressing or conditioning abrasive surfaces
001involving the use of electric current
B24B 7/228
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
7Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
20characterised by a special design with respect to properties of the material of non-metallic articles to be ground
22for grinding inorganic material, e.g. stone, ceramics, porcelain
228for grinding thin, brittle parts, e.g. semiconductors, wafers
B24D 5/12
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING, OR SHARPENING
5Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
12Cut-off wheels
B28D 5/022
BPERFORMING OPERATIONS; TRANSPORTING
28WORKING CEMENT, CLAY, OR STONE
DWORKING STONE OR STONE-LIKE MATERIALS
5Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
02by rotary tools, e.g. drills
022by cutting with discs or wheels
B28D 5/023
BPERFORMING OPERATIONS; TRANSPORTING
28WORKING CEMENT, CLAY, OR STONE
DWORKING STONE OR STONE-LIKE MATERIALS
5Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
02by rotary tools, e.g. drills
022by cutting with discs or wheels
023with a cutting blade mounted on a carriage
Applicants
  • RIKEN [JP]/[JP] (AllExceptUS)
  • SHOWA DENKO K.K. [JP]/[JP] (AllExceptUS)
  • OHMORI, Hitoshi [JP]/[JP] (UsOnly)
  • YAMAGATA, Yutaka [JP]/[JP] (UsOnly)
  • ITOH, Nobuhide [JP]/[JP] (UsOnly)
  • NAGATO, Nobuyuki [JP]/[JP] (UsOnly)
  • YANO, Kotaro [JP]/[JP] (UsOnly)
  • OYANAGI, Naoki [JP]/[JP] (UsOnly)
Inventors
  • OHMORI, Hitoshi
  • YAMAGATA, Yutaka
  • ITOH, Nobuhide
  • NAGATO, Nobuyuki
  • YANO, Kotaro
  • OYANAGI, Naoki
Agents
  • HOTTA, Minoru
Priority Data
10/25061104.09.1998JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD AND DEVICE FOR CUTTING AND MIRROR FINISHING SINGLE CRYSTAL SILICON CARBIDE
(FR) PROCEDE ET DISPOSITIF DE COUPE ET DE POLISSAGE MIROIR DE CARBURE DE SILICIUM MONOCRISTALLIN
Abstract
(EN)
A device for cutting and mirror finishing a single crystal SiC comprising a metal bonded wheel (10) consisting of a flat sheet portion (10a) rotating on the axis Z and a taper portion (10b) provided on the outer side of the flat sheet portion and gradually thinning toward the outer sides, an electrode (13) facing the metal bonded wheel with a gap therebetween, a voltage application means (12) for applying a dc pulse voltage between the wheel and the electrode with the wheel as a positive electrode, a working fluid supplying means (14) for supplying a conductive working fluid (15) between the wheel and the electrode and a wheel moving means (16) for moving the wheel in a direction perpendicular to the axis of the wheel, wherein the taper portion (10b) of the wheel cuts a single crystal SiC ingot (1) and then the flat sheet portion (10a) mirror finishes the cut face, whereby it is possible to slice the single crystal SiC ingot into flat sheets efficiently and finish the cut faces to mirror-face-like flatness.
(FR)
La présente invention concerne un dispositif de coupe et de polissage miroir de SiC monocristallin comprenant une roue liée par métal (10) qui consiste en une partie feuille plate (10a) en rotation sur l'axe Z et une partie conique (10b) située sur le côté extérieur de la partie feuille plate s'affinant vers les côtés extérieures, une électrode (13) faisant face à la roue liée par métal et séparée de cette dernière par un intervalle, un applicateur de tension (12) pour appliquer une tension d'impulsion continue entre la roue et l'électrode, la roue servant d'électrode positive, une source de fluide de travail (14) pour fournir un fluide de travail conducteur (15) entre la roue et l'électrode, et un dispositif d'entraînement de roue (16) pour déplacer la roue dans un sens perpendiculaire à l'axe de la roue. En outre, la partie conique (10b) de la roue découpe un lingot de SiC monocristallin (1), puis la partie feuille plate (10a) réalise le polissage miroir de la face ainsi coupée. Ainsi, il est possible de couper efficacement le lingot SiC monocristallin en feuilles plates et de polir les faces découpées pour obtenir une planéité miroir.
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