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1. WO2000010736 - PRINTING OF ELECTRONIC CIRCUITS AND COMPONENTS

Publication Number WO/2000/010736
Publication Date 02.03.2000
International Application No. PCT/US1998/025088
International Filing Date 24.11.1998
Chapter 2 Demand Filed 17.03.2000
IPC
H01C 17/06 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
CRESISTORS
17Apparatus or processes specially adapted for manufacturing resistors
06adapted for coating resistive material on a base
C23C 18/16 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, i.e. electroless plating
H01F 17/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
17Fixed inductances of the signal type
H01G 4/228 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
4Fixed capacitors; Processes of their manufacture
002Details
228Terminals
H01G 4/33 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
4Fixed capacitors; Processes of their manufacture
33Thin- or thick-film capacitors
H01L 21/288 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/268158
283Deposition of conductive or insulating materials for electrodes
288from a liquid, e.g. electrolytic deposition
CPC
C23C 18/06
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
02by thermal decomposition
06Coating on selected surface areas, e.g. using masks
C23C 18/1216
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
02by thermal decomposition
12characterised by the deposition of inorganic material other than metallic material
1204inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
1208Oxides, e.g. ceramics
1216Metal oxides
C23C 18/143
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
14Decomposition by irradiation, e.g. photolysis, particle radiation ; or by mixed irradiation sources
143Radiation by light, e.g. photolysis or pyrolysis
H01G 4/228
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
4Fixed capacitors; Processes of their manufacture
002Details
228Terminals
H01L 21/288
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
283Deposition of conductive or insulating materials for electrodes ; conducting electric current
288from a liquid, e.g. electrolytic deposition
H01L 51/0004
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
0002Deposition of organic semiconductor materials on a substrate
0003using liquid deposition, e.g. spin coating
0004using printing techniques, e.g. ink-jet printing, screen printing
Applicants
  • SRI INTERNATIONAL [US]/[US] (AllExceptUS)
  • NARANG, Subhash [US]/[US] (UsOnly)
  • SHARMA, Sunity [IN]/[US] (UsOnly)
  • COX, Philip [GB]/[US] (UsOnly)
  • VENTURA, Susanna [IT]/[US] (UsOnly)
Inventors
  • NARANG, Subhash
  • SHARMA, Sunity
  • COX, Philip
  • VENTURA, Susanna
Agents
  • FISH, Robert, D.
Priority Data
60/097,70621.08.1998US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PRINTING OF ELECTRONIC CIRCUITS AND COMPONENTS
(FR) IMPRESSION DE CIRCUITS ET COMPOSANTS ELECTRONIQUES
Abstract
(EN)
Methods are disclosed for printing (2-7) multilayer electronic components, and circuits on a surface (2), where at least one of the layers is formed by a redox reaction (6) occurring in a deposited solution (4, 5). Electronic components may comprise semiconductors such as in transistors or diode, or metal oxide or electrolyte such as in batteries or fuel cells, or are capacitors, inductors, and resistors. Preferably, the oxidizer of the redox reaction is a strong oxidizer, and the reducer is a strong reducer (3). Reactions are preferably sufficiently exothermic that they can be initiated (6), rather than driven to completion, by microwave or other suitable energy sources, and may yield substantially pure metal or metal oxide layers. The solution being deposited (5) may have either high concentrations of particulates, such as 60-80 wt.% of dry weight, or low concentrations of particulates, such as $m(F)5 wt.% or $m(F)2 wt.%. Low particulate content provides printing of structures having lateral resolution of $m(F)10 $g(m)m, $m(F)5 $g(m)m, or $m(F)1 $g(m)m.
(FR)
L'invention concerne des procédés d'impression (2-7) de composants électroniques multicouche et de circuits sur une surface (2), une des couches au moins étant réalisée par une réaction d'oxydoréduction (6) ayant lieu dans une solution déposée (4, 5). Les composants électroniques peuvent comprendre des semi-conducteurs comme par exemple ceux qui se trouvent dans les transistors ou diodes, un oxyde métallique ou un électrolyte comme ceux que l'on trouve dans les piles ou les piles à combustible ou des condensateurs, inducteurs et résistances. L'oxydant de la réaction d'oxydoréduction est de préférence un puissant oxydant et le réducteur est un puissant réducteur (3). Les réactions sont de préférence suffisamment exothermiques pour pouvoir être mises en route (6) plutôt que terminées par des micro-ondes ou d'autres sources d'énergies adéquates. Ces réactions produisent des couches métalliques pures ou d'oxydes métalliques. La solution déposée (5) peut présenter de fortes concentrations de particules, entre 60 et 80 % en poids sec ou de faibles concentrations de particules inférieures ou égales à 5 % en poids ou inférieures ou égales à 2 % en poids. Une faible concentration en particules assure une impression de structure dont la résolution latérale est inférieure ou égale à 10 $g(m)m, inférieure ou égale à 5 $g(m)m ou inférieure ou égale à 1 $g(m)m.
Latest bibliographic data on file with the International Bureau