Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO1999056889) METHOD AND APPARATUS FOR DISPENSING SMALL AMOUNTS OF LIQUID MATERIAL
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1999/056889 International Application No.: PCT/US1999/009388
Publication Date: 11.11.1999 International Filing Date: 30.04.1999
Chapter 2 Demand Filed: 12.11.1999
IPC:
B05C 5/00 (2006.01) ,B05C 5/02 (2006.01) ,B05C 11/10 (2006.01) ,B23K 1/20 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
C
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
5
Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
C
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
5
Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
02
from an outlet device in contact, or almost in contact, with the work
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
C
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
11
Component parts, details or accessories not specifically provided for in groups B05C1/-B05C9/132
10
Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1
Soldering, e.g. brazing, or unsoldering
20
Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
Applicants:
NORDSON CORPORATION [US/US]; 28601 Clemens Road Westlake, OH 44145, US
Inventors:
MESSERLY, James, W.; US
SAIDMAN, Laurence, B.; US
SMITH, James, C.; US
Agent:
ROONEY, Kevin, G. ; Wood, Herron & Evans L.L.P. 2700 Carew Tower Cincinnati, OH 45202, US
LLOYD WISE, TREGEAR & CO.; Commonwealth House 1-19 New Oxford Street London WC1A 1LW, GB
Priority Data:
09/070,94601.05.1998US
Title (EN) METHOD AND APPARATUS FOR DISPENSING SMALL AMOUNTS OF LIQUID MATERIAL
(FR) PROCEDE ET DISPOSITIF PERMETTANT DE DISTRIBUER DE PETITES QUANTITES DE MATIERE LIQUIDE
Abstract:
(EN) Apparatus and methods for dispensing droplets of liquid or viscous material. The apparatus generally comprises a valve operated dispenser (10) and a control (128', 129) for moving the valve member (42') with respect to a valve seat (38') in rapid succession. This rapidly accelerates liquid or viscous material in a stream from the dispenser outlet and immediately breaks the stream into a minute droplet. Various embodiments of the valve seat (38') include both rigid valve seats and resilient valve seats. Resilient valve seats are especially useful for dispensing solder pastes as they can prevent material flaking, compacting and clogging conditions. Low friction polymer or plastic material for dispenser components such as the valve member (42') and outlet structure (40') can also prevent such problems.
(FR) L'invention concerne un dispositif et des procédés permettant la distribution de gouttelettes d'une matière liquide ou visqueuse. Ce dispositif comprend en général un distributeur (10) opéré par une soupape, et une commande (128', 129) permettant de déplacer l'élément soupape (42') par rapport au siège (38') de soupape dans un mouvement de succession rapide. Ce processus accélère rapidement la matière liquide ou visqueuse d'un flux sortant de l'orifice de distribution et interrompt immédiatement ce flux pour former un gouttelette minuscule. Les diverses versions du siège (38') de soupape comprennent des sièges rigides et des sièges souples. Les sièges de soupape souples conviennent en particulier pour distribuer des pâtes de soudure, car elle peuvent empêcher les problèmes d'effritement, de compression et de colmatage du matériau. Ces problèmes peuvent également être évités par l'utilisation de matériaux polymères ou plastiques à coefficient de frottement réduit pour les composants de distribution tels que l'élément (42') de soupape et la structure (40') de l'orifice de sortie.
front page image
Designated States: AE, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CU, CZ, DE, DK, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, UA, UG, UZ, VN, YU, ZA, ZW
African Regional Intellectual Property Organization (ARIPO) (GH, GM, KE, LS, MW, SD, SL, SZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP1073527JP2002513674 CA2330953AU1999038733