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1. (WO1999056113) A SYSTEM AND METHOD FOR INSPECTING SEMICONDUCTOR WAFERS
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/1999/056113 International Application No.: PCT/US1999/009555
Publication Date: 04.11.1999 International Filing Date: 30.04.1999
Chapter 2 Demand Filed: 24.11.1999
IPC:
G01N 21/95 (2006.01) ,G01N 21/956 (2006.01)
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21
Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible, or ultra-violet light
84
Systems specially adapted for particular applications
88
Investigating the presence of flaws, defects or contamination
95
characterised by the material or shape of the object to be examined
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21
Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible, or ultra-violet light
84
Systems specially adapted for particular applications
88
Investigating the presence of flaws, defects or contamination
95
characterised by the material or shape of the object to be examined
956
Inspecting patterns on the surface of objects
Applicants:
ROSENGAUS, Eliezer [US/US]; US (UsOnly)
LANGE, Steven, R. [US/US]; US (UsOnly)
KLA-TENCOR CORPORATION [US/US]; 160 Rio Robles San Jose, CA 95134-1809, US (AllExceptUS)
Inventors:
ROSENGAUS, Eliezer; US
LANGE, Steven, R.; US
Agent:
VILLENEUVE, Joseph, M.; Beyer & Weaver LLP P.O. Box 61059 Palo Alto, CA 94306, US
Priority Data:
09/070,43730.04.1998US
Title (EN) A SYSTEM AND METHOD FOR INSPECTING SEMICONDUCTOR WAFERS
(FR) SYSTEME ET PROCEDE D'INSPECTION DE TRANCHES DE SEMI-CONDUCTEURS
Abstract:
(EN) A method for inspecting semiconductor wafers is provided in which a plurality of independent, low cost, optical-inspection subsystems (30) are packaged and integrated to simultaneously perform parallel inspections of portions of the wafer (20), the wafer location relative to the inspection being controlled so that the entire wafer (20) is imaged by the system of optical subsystems (30) in a raster-scan mode. A monochromatic coherent-light source illuminates the wafer surface. A darkfield-optical system collects scattered light and filters patterns produced by valid periodic wafer structures using Fourier filtering. The filtered light is processed by general purpose digital-signal processors (19). Image subtraction methods are used to detect wafer defects, which are reported to a main computer (50) to aid in statistical process control, particularly for manufacturing equipment.
(FR) La présente invention concerne un procédé d'inspection de tranches de semi-conducteurs selon lequel plusieurs sous-systèmes d'inspection optique (30) indépendants et peu coûteux sont groupés et intégrés afin d'effectuer simultanément des inspections parallèles de parties de la tranche (20), l'emplacement de la tranche par rapport à l'inspection étant réglé de façon que le système de sous-systèmes optiques (30) parvient à former une image de la tranche entière (20) en mode de balayage ligne. Une source de lumière cohérente monochromatique illumine la surface de la tranche. Un système optique à fond noir collecte la lumière diffusée et filtre les motifs produits par les structures de tranche périodiques valables par filtrage de Fourier. La lumière filtrée est traitée par des processeurs de signaux numériques non spécialisés (19). Des procédés de soustraction d'images sont utilisés pour détecter les défauts des tranches, qui sont signalés à un ordinateur principal (50) afin de faciliter le contrôle statistique du processus, en particulier dans la fabrication d'équipements.
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Designated States: AE, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CU, CZ, DE, DK, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, UA, UG, US, UZ, VN, YU, ZA, ZW
African Regional Intellectual Property Organization (ARIPO) (GH, GM, KE, LS, MW, SD, SL, SZ, UG, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)