Processing

Please wait...

Settings

Settings

Goto Application

1. WO1999055935 - METHOD FOR COATING SURFACES OF COPPER OR OF A COPPER ALLOY WITH A TIN OR TIN ALLOY LAYER

Publication Number WO/1999/055935
Publication Date 04.11.1999
International Application No. PCT/DE1999/001176
International Filing Date 15.04.1999
Chapter 2 Demand Filed 29.10.1999
IPC
C23C 18/28 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, i.e. electroless plating
18Pretreatment of the material to be coated
20of organic surfaces, e.g. resins
28Sensitising or activating
C23C 18/31 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, i.e. electroless plating
31Coating with metals
H05K 3/24 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
24Reinforcing of the conductive pattern
CPC
C23C 18/1844
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
1803of metallic material surfaces or of a non-specific material surfaces
1824by chemical pretreatment
1837Multistep pretreatment
1844with use of organic or inorganic compounds other than metals, first
C23C 18/31
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
31Coating with metals
H05K 3/244
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
24Reinforcing the conductive pattern
244Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Applicants
  • ATOTECH DEUTSCHLAND GMBH [DE]/[DE] (AllExceptUS)
  • MAHLKOW, Hartmut [DE]/[DE] (UsOnly)
  • BACKUS, Petra [DE]/[DE] (UsOnly)
Inventors
  • MAHLKOW, Hartmut
  • BACKUS, Petra
Agents
  • EFFERT, BRESSEL UND KOLLEGEN
Priority Data
198 18 910.923.04.1998DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VERFAHREN ZUM ÜBERZIEHEN VON OBERFLÄCHEN AUF KUPFER ODER EINER KUPFERLEGIERUNG MIT EINER ZINN- ODER ZINNLEGIERUNGSSCHICHT
(EN) METHOD FOR COATING SURFACES OF COPPER OR OF A COPPER ALLOY WITH A TIN OR TIN ALLOY LAYER
(FR) PROCEDE POUR RECOUVRIR DES SURFACES DE CUIVRE OU D'ALLIAGE DE CUIVRE AVEC UNE COUCHE D'ETAIN OU D'ALLIAGE D'ETAIN
Abstract
(DE)
Mit bekannten Verfahren zum Verzinnen von Kupferoberflächen werden keine ausreichend guten Lötergebnisse erhalten. Insbesondere bleiben die Oberflächen nach thermischer Behandlung nicht lötfähig. Zur Beseitigung dieses Problems wird ein Verfahren zum Überziehen von Oberflächen auf Kupfer oder einer Kupferlegierung mit einer Schicht aus Zinn oder einer Zinnlegierung eingesetzt, das folgende wesentliche Verfahrensschritte aufweist: a) Behandeln der Oberflächen mit einer Lösung, enthaltend mindestens eine Edelmetallverbindung, um Edelmetall abzuscheiden; b) Behandeln der gemäß Schritt a) mit Edelmetall beschichteten Oberflächen mit einer Lösung, enthaltend mindestens eine Zinnverbindung, mindestens eine Säure und mindestens einen Komplexbildner für Kupfer aus der Gruppe, bestehend aus Thioharnstoff und dessen Derivaten, um die Zinn- oder Zinnlegierungsschicht zu bilden.
(EN)
Sufficiently good soldering results can not be obtained using known methods for tinning copper surfaces. In particular, the surfaces remain incapable of being soldered after thermal treatment. To eliminate this problem, a method is used for coating surfaces of copper or of a copper alloy with a layer made of tin or of a tin alloy. Said method comprises the essential following steps: a) treating the surfaces with a solution containing at least one noble metal compound in order to deposit noble metal; b) treating the surfaces which are coated with noble metal according to step a) with a solution containing at least one tin compound, at least one acid and at least one complexing agent for copper from the group comprised of thiourea and the derivatives thereof in order to form the tin or tin alloy layer.
(FR)
Avec les procédés connus permettant d'étamer des surfaces de cuivre, on n'obtient aucun résultat de soudure satisfaisant. En particulier, les surfaces, après leur traitement thermique, ne sont pas aptes à la brasure. Pour éviter ce problème, on met en oeuvre un procédé permettant de recouvrir des surfaces de cuivre ou d'alliage de cuivre avec une couche d'étain ou d'alliage d'étain, lequel comprend les étapes essentielles suivantes: a) traitement des surfaces avec une solution contenant au moins un composé de métal noble, pour y déposer un métal noble; b) traitement des surfaces recouvertes du métal noble selon l'étape a) avec une solution contenant au moins un composé d'étain, au moins un acide et au moins un complexant destiné au cuivre, pris dans le groupe constitué de la thiourée et de ses dérivés, pour former la couche d'étain ou d'alliage d'étain.
Also published as
KR1020007011307
US09673762
Latest bibliographic data on file with the International Bureau