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Machine translation
1. (WO1999040624) INTEGRATED CIRCUIT DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1999/040624    International Application No.:    PCT/IL1999/000071
Publication Date: 12.08.1999 International Filing Date: 03.02.1999
Chapter 2 Demand Filed:    07.09.1999    
IPC:
H01L 23/31 (2006.01), H01L 23/485 (2006.01), H01L 25/10 (2006.01), H01L 27/146 (2006.01), H01L 27/15 (2006.01), H01L 31/02 (2006.01), H01L 31/0203 (2006.01), H01L 33/58 (2010.01), H01L 33/62 (2010.01)
Applicants: SHELLCASE LTD. [IL/IL]; Manhat Technology Park, P.O. Box 48328, 96251 Jerusalem (IL) (For All Designated States Except US).
BADEHI, Avner [IL/IL]; (IL) (For US Only)
Inventors: BADEHI, Avner; (IL)
Agent: COLB, Sanford, T.; Sanford T. Colb & Co., P.O. Box 2273, 76122 Rehovot (IL).
ZEILINSKI, Walt, Thomas; DARBY & DARBY P.C., 805 Third Avenue, New York, New York 1022-7513 (US)
Priority Data:
123207 06.02.1998 IL
Title (EN) INTEGRATED CIRCUIT DEVICE
(FR) DISPOSITIF A CIRCUITS INTEGRES
Abstract: front page image
(EN)An integrally packaged optronic integrated circuit device (310) including an integrated circuit die (322) containing at least one of a radiation emitter and radiation receiver and having top and bottom surfaces formed of electrically insulative and mechanically protective material, at least one of the surfaces (317) being transparent to radiation, and electrically insulative edge surfaces (314) having pads.
(FR)Dispositif (310) à circuits intégrés optoélectronique encapsulé d'un seul tenant, qui comporte une puce (322) contenant un émetteur de rayonnement et/ou un récepteur de rayonnement. Ledit dispositif comporte en outre des surfaces supérieure et inférieure constituées d'une matière électriquement isolante et mécaniquement protectrice, au moins une desdites surfaces (317) étant transparente aux rayonnements, ainsi que des bords latéraux (314) électriquement isolants dotés de plots de connexion (312).
Designated States: AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CU, CZ, DE, DK, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, UA, UG, US, UZ, VN, YU, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, SD, SZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)