WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO1999039889) THERMALLY EFFICIENT MOLD APPARATUS AND METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1999/039889    International Application No.:    PCT/US1999/002565
Publication Date: 12.08.1999 International Filing Date: 05.02.1999
Chapter 2 Demand Filed:    01.09.1999    
IPC:
B29C 33/04 (2006.01), B29C 33/38 (2006.01)
Applicants: EXPRESS TOOL, INC. [US/US]; 300 Metro Center Boulevard Warwick, RI 02886 (US)
Inventors: FEELEY, Terrance; (US).
JACOBS, Paul; (US).
MCDONALD, Thomas; (US).
MELLO, Mark; (US)
Agent: GREEN, Clarence, A.; Perman & Green, LLP 425 Post Road Fairfield, CT 06430 (US)
Priority Data:
60/073,880 06.02.1998 US
Title (EN) THERMALLY EFFICIENT MOLD APPARATUS AND METHOD
(FR) APPAREIL DE MOULAGE THERMIQUEMENT EFFICACE ET PROCEDE DE FABRICATION ASSOCIE
Abstract: front page image
(EN)A mold insert or tool (1) of this invention is constructed having an active surface (5) formed on a thin shell (2) from a hardened tool material, thermal management passages (8) molded into the back of the active surface element (2) in an arrangement which substantially conforms to the thermal stress lines generated by the shape of the active surface (5), a copper thermal management layer (4, 9) to enclose the thermal management passages (8), and to add structure to the mold insert (1).
(FR)Selon l'invention, on fabrique une empreinte rapportée ou un outil (1) comprenant une surface active (5) formée sur une enveloppe mince (2) à partir d'un matériau d'outil trempé, des passages (8) de régulation thermique formés sur le dos de l'élément (2) comprenant une surface active, selon une agencement qui se conforme sensiblement aux lignes de contrainte thermique engendrées par la forme de la surface active (5), et une couche (4, 9) de régulation thermique en cuivre de manière à entourer les passages (8) de régulation thermique, et à renforcer la structure de l'empreinte rapportée (1).
Designated States: AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CU, CZ, DE, DK, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, UA, UG, UZ, VN, YU, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, SD, SZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)