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Machine translation
1. (WO1999011106) A CHIP SUPPORTING ELEMENT AND USE THEREOF
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1999/011106    International Application No.:    PCT/SE1998/001484
Publication Date: 04.03.1999 International Filing Date: 18.08.1998
Chapter 2 Demand Filed:    10.03.1999    
IPC:
H01L 23/13 (2006.01), H01L 23/367 (2006.01), H01L 23/498 (2006.01)
Applicants: TELEFONAKTIEBOLAGET LM ERICSSON (publ) [SE/SE]; S-126 25 Stockholm (SE)
Inventors: BERGSTEDT, Leif; (SE).
LUNDH, Ros-Marie; (SE)
Agent: SCHLOSSMAN, Ulf; Albihns Patentbyrå Göteborg AB P.O. Box 142 S-401 22 Göteborg (SE)
Priority Data:
9703061-3 25.08.1997 SE
Title (EN) A CHIP SUPPORTING ELEMENT AND USE THEREOF
(FR) ELEMENT SUPPORTANT UNE PUCE ET UTILISATION DE CET ELEMENT
Abstract: front page image
(EN)A chip supporting element comprises a ductile foil (1) of electrically and thermally conducting material having a stabilizing frame (2) around the site where at least one chip (3) is to be fixed to the foil (1).
(FR)L'invention concerne un élément supportant une puce et comprenant une feuille ductile (1) réalisée dans un matériau électriquement et thermiquement conducteur ayant un cadre de stabilisation (2) autour de l'emplacement où au moins une puce (3) doit être fixée à la feuille (1).
Designated States: AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CU, CZ, DE, DK, EE, ES, FI, GB, GE, GH, GM, HR, HU, ID, IL, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, UA, UG, UZ, VN, YU, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, SD, SZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)