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Machine translation
1. (WO1999008495) METHOD OF MANUFACTURING SURFACE-MOUNTABLE SIL HYBRID CIRCUIT
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1999/008495    International Application No.:    PCT/FI1998/000622
Publication Date: 18.02.1999 International Filing Date: 10.08.1998
Chapter 2 Demand Filed:    05.03.1999    
IPC:
H01L 23/498 (2006.01), H05K 3/34 (2006.01), H05K 3/36 (2006.01)
Applicants: MÄÄTTÄ, Hannu [FI/FI]; (FI).
NOKIA NETWORKS OY [FI/FI]; Keilalahdentie 4 FIN-02150 Espoo (FI) (AL, AM, AT, AU, AZ, BA, BB, BE, BF, BG, BJ, BR, BY, CA, CF, CG, CH, CI, CM, CN, CU, CY, CZ, DE, DK, EE, ES, FI, FR, GA, GB, GE, GH, GM, GN, GR, GW, HR, HU, ID, IE, IL, IS, IT, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MC, MD, MG, MK, ML, MN, MR, MW, MX, NE, NL, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, SN, SZ, TD, TG, TJ, TM, TR, TT, UA, UG, UZ, VN, YU, ZW only)
Inventors: MÄÄTTÄ, Hannu; (FI)
Agent: LAURINOLLI, Tapio; Patenttitoimisto Tapio Laurinolli P.O. Box 258 FIN-90101 Oulu (FI)
Priority Data:
973268 08.08.1997 FI
Title (EN) METHOD OF MANUFACTURING SURFACE-MOUNTABLE SIL HYBRID CIRCUIT
(FR) PROCEDE DE FABRICATION DE CIRCUITS HYBRIDES SIL MONTES EN SAILLIE
Abstract: front page image
(EN)A method of manufacturing SIL hybrid circuits wherein a hybrid circuit (1) is attached to the corresponding clip members (25) of a lead frame (20), and excessive parts (21, 22, 26, 27) are removed from the lead frame (20) so that the clip members (25) attached to said hybrid circuit (1) and the corresponding foot members (24) are left, is characterized in that the lead frame (20) is manufactured and/or the excessive parts are removed therefrom so that one or more support members (26', 30; 31, 32) are left with respect to one SIL hybrid circuit (1) for supporting the same during positioning and surface mounting. The method makes possible the efficient utilization of SIL hybrid circuits in the packaging technology in which the components are mounted from a tape by means of automatic machines and then connected by surface mounting techniques.
(FR)L'invention concerne un procédé de fabrication de circuits hybrides SIL. Selon ce procédé, un circuit hybride (1) est relié aux pinces correspondantes (25) d'une grille de connexion (20), les autres éléments (21, 22, 26, 27) de cette grille (20)étant retirés de cette dernière, de manière à ne laisser que lesdites pinces (25), auxquelles est relié le circuit hybride (1), ainsi que les pieds correspondants (24). La grille de connexion (20) est conçue, et/ou les éléments retirés de celle-ci, de manière à ce qu'un ou plusieurs supports (26', 30; 31, 32) soutiennent un circuit hybride SIL (1) au moment de son placement et de son montage en saillie. Le procédé de la présente invention permet notamment une utilisation efficace desdits circuits hybrides SIL dans le domaine de l'emballage, les composants étant montés à partir d'une bande au moyen de machines automatiques, avant d'être raccordés selon des techniques de montage en saillie.
Designated States: AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CU, CZ, DE, DK, EE, ES, FI, GB, GE, GH, GM, HR, HU, ID, IL, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, UA, UG, US, UZ, VN, YU, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, SD, SZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: Finnish (FI)