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1. (WO1999007014) INTERPOSER/ADHESIVE COMPOSITE

Pub. No.:    WO/1999/007014    International Application No.:    PCT/US1998/013554
Publication Date: Feb 11, 1999 International Filing Date: Jun 29, 1998
IPC: H01L 23/31
H01L 23/498
Applicants: MINNESOTA MINING AND MANUFACTURING COMPANY
Inventors: BIERNATH, Rolf, W.
SCHWARTZ, Eric, M.
JAHNKE, Donelly, M.
FARMER, William, A.
PAGE, George, E.
McHATTIE, James, S.
Title: INTERPOSER/ADHESIVE COMPOSITE
Abstract:
This invention concerns a composite (100) useful as a pad for integrated circuits, comprising an elastomer layer (110) having a first side and a second side, a first adhesive layer (120) attached to the first side; a second adhesive layer (130) attached to the second side; wherein the first and second adhesive layers (120, 130) are made of a different material than the elastomer layer (110).