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1. (WO1999005746) THERMAL MANAGEMENT SYSTEM AND METHOD FOR A SOLID-STATE ENERGY STORING DEVICE

Pub. No.:    WO/1999/005746    International Application No.:    PCT/US1998/015290
Publication Date: Fri Feb 05 00:59:59 CET 1999 International Filing Date: Fri Jul 24 01:59:59 CEST 1998
IPC: H01M 2/20
H01M 6/18
H01M 6/50
H01M 10/04
H01M 10/40
H01M 10/50
Applicants: MINNESOTA MINING AND MANUFACTURING COMPANY
HYDRO-QUEBEC CORPORATION
Inventors: ROUILLARD, Roger
DOMROESE, Michael, K.
GAUTHIER, Michel
HOFFMAN, Joseph, A.
LINDEMAN, David, D.
NOEL, Joseph-Robert-Gaetan
RADEWALD, Vern, E.
RANGER, Michel
ROUILLARD, Jean
SHIOTA, Toshimi
ST-GERMAIN, Philippe
SUDANO, Anthony
TRICE, Jennifer, L.
TURGEON, Thomas, A.
Title: THERMAL MANAGEMENT SYSTEM AND METHOD FOR A SOLID-STATE ENERGY STORING DEVICE
Abstract:
An improved electrochemical energy storing device includes a number of thin-film electrochemical cells which are maintained in a state of compression through use of an internal or an external pressure apparatus. A thermal conductor, which is connected to at least one of the positive or negative contacts of each electrochemical cell, conducts current into and out of the electrochemical cells and also conducts thermal energy between the electrochemical cells and thermally conductive material disposed on a wall structure adjacent the conductors. The wall structure includes electrically resistive material, such as an anodized coating or a thin film of plastic. The thermal conductors are fabricated to include a spring mechanism which expands and contacts to maintain mechanical contact between the electrochemical cells and the thermally conductive material in the presence of relative movement between the electrochemical cells and the wall structure. An active cooling apparatus may be employed external to a hermetically sealed housing containing the electrochemical cells to enhance the transfer of thermal energy into and out of the electrochemical cells. An integrated interconnect board may be disposed within the housing onto which a number of electrical and electro-mechanical components are mounted. Heat generated by the components is conducted from the interconnect board to the housing using the thermal conductors.