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1. WO1999005718 - MATERIAL TABLET AND METHOD FOR THE PRODUCTION OF A PLASTIC COMPOSITE BODY

Publication Number WO/1999/005718
Publication Date 04.02.1999
International Application No. PCT/DE1998/002032
International Filing Date 20.07.1998
IPC
B29C 45/14 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
45Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
14incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
B29C 45/46 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
45Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
17Component parts, details or accessories; Auxiliary operations
46Means for plasticising or homogenising the moulding material or forcing it into the mould
H01L 21/56 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56Encapsulations, e.g. encapsulating layers, coatings
CPC
B29C 45/14655
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
45Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
14incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
14639for obtaining an insulating effect, e.g. for electrical components
14655connected to or mounted on a carrier, e.g. lead frame
B29C 45/462
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
45Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
17Component parts, details or accessories; Auxiliary operations
46Means for plasticising or homogenising the moulding material or forcing it into the mould
462Injection of preformed charges of material
H01L 21/565
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
565Moulds
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applicants
  • SIEMENS AKTIENGESELLSCHAFT [DE]/[DE] (AllExceptUS)
  • SCHMIDT, Hans-Friedrich [DE]/[DE] (UsOnly)
  • BEDNARZ, Jürgen [DE]/[DE] (UsOnly)
  • TEEPEN, Frank [DE]/[DE] (UsOnly)
  • WAGNER, Georg [DE]/[DE] (UsOnly)
Inventors
  • SCHMIDT, Hans-Friedrich
  • BEDNARZ, Jürgen
  • TEEPEN, Frank
  • WAGNER, Georg
Common Representative
  • SIEMENS AG
Priority Data
197 31 202.021.07.1997DE
Publication Language German (de)
Filing Language German (DE)
Designated States
Title
(DE) MATERIALTABLETTE SOWIE VERFAHREN ZUM HERSTELLEN EINES KUNSTSTOFFVERBUNDKÖRPERS
(EN) MATERIAL TABLET AND METHOD FOR THE PRODUCTION OF A PLASTIC COMPOSITE BODY
(FR) PASTILLE DE MATIERE AINSI QUE PROCEDE POUR LA FABRICATION D'UN CORPS COMPOSITE EN PLASTIQUE
Abstract
(DE) Beim erfindungsgemäßen Verfahren zum Herstellen eines Kunstoffverbundkörpers erfolgt nach dem Schritt des Einsetzens von duroplastischem Material (10) der Schritt des Einsetzens wenigstens eines Sekundärmaterials (11) in einen Angußbereich (5) der Preßform (1). Die Erfindung beruht auf dem Grundgedanken, daß der Prozeß so geführt wird, daß im wesentlichen lediglich ein zu umgießender Grundkörper (7) mit hochwertiger Preßmasse (10) umhüllt ist, während der Angußbereich (5, 6) der Preßform (1) mit einem minderwertigen Material (11) ausgepreßt wird.
(EN) The invention relates to a method for producing a plastic composite body, wherein at least one secondary material (11) is introduced in the gating area (5) of the pressing mold (1) after the duro-plastic material (10) has been introduced. The invention is based on the underlying idea that essentially a base body (7), which is exclusively to be remelted, is covered with a high-grade molding compound, while the gating area (5, 6) of the pressing mold (1) is injected with a low-grade material (11).
(FR) L'invention concerne un procédé pour la fabrication d'un corps composite en plastique, consistant à introduire au moins une matière secondaire (11) dans une zone d'entrée (5) du moule (1), après introduction de la matière thermodurcissable (10). L'invention repose sur l'idée de base que le processus est conduit de sorte qu'en principe uniquement un corps de base (7) à refondre est enrobé de matière moulée (10) de haute qualité tandis que dans la zone d'entrée (5, 6) du moule (1) est injectée une matière (11) de moindre qualité.
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