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1. WO1999003315 - A DEVICE AND METHOD IN ELECTRONICS SYSTEMS

Publication Number WO/1999/003315
Publication Date 21.01.1999
International Application No. PCT/SE1998/001164
International Filing Date 26.06.1998
Chapter 2 Demand Filed 02.02.1999
IPC
H05K 1/02 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 3/22 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
H05K 3/34 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
CPC
H05K 1/024
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0213Electrical arrangements not otherwise provided for
0237High frequency adaptations
024Dielectric details, e.g. changing the dielectric material around a transmission line
H05K 2201/09036
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09009Substrate related
09036Recesses or grooves in insulating substrate
H05K 2201/09781
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
09654covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
09781Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
H05K 2201/10363
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10227Other objects, e.g. metallic pieces
10363Jumpers, i.e. non-printed cross-over connections
H05K 2201/10636
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10613Details of electrical connections of non-printed components, e.g. special leads
10621Components characterised by their electrical contacts
10636Leadless chip, e.g. chip capacitor or resistor
H05K 3/222
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
222Completing of printed circuits by adding non-printed jumper connections
Applicants
  • TELEFONAKTIEBOLAGET LM ERICSSON (publ) [SE]/[SE]
Inventors
  • BERGSTEDT, Leif, Roland
  • CARLBERG, Bo
Agents
  • ERICSSON RADIO SYSTEMS AB
Priority Data
9702687-611.07.1997SE
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) A DEVICE AND METHOD IN ELECTRONICS SYSTEMS
(FR) DISPOSITIF ET PROCEDE DESTINES A DES SYSTEMES ELECTRONIQUES
Abstract
(EN) The present invention relates to a device and a method at a printed board for obtaining good transmission qualities in transmission conductors on a predetermined area (10) of the printed board (11). A separate component (1) for signal transmission comprises a conductor (5). The component (1) is mounted, with the conductor facing the printed board (11), over the area (10) of the printed board, which requires good transmissions qualities, whereby an air gap (L) is obtained between the conductor (5) and the printed board (11). Soldering joints (21) connect each one of the outer parts (7a, 7b) of the conductor (5) of the component (1) to corresponding pattern conductors (17a, 17b) on the printed board (11). The thickness of the soldering connections and the thickness of the pattern conductors form the air gap (L) between the conductor (5) and the printed board (11). In an alternative embodiment according to the invention, a groove (23) is milled out of the printed board (11) under the conductor (5), obtaining an enlarged air gap between the conductor (5) and the printed board (11).
(FR) L'invention concerne un dispositif et un procédé concernant une carte à circuits imprimés permettant d'obtenir une bonne qualité de transmission dans les conducteurs de transmission d'une zone déterminée (10) de la carte à circuits imprimés (11). Un composant séparé (1) destiné à la transmission des signaux comporte un conducteur (5). Ce composant (1) est monté, avec le conducteur faisant face à la carte à circuits imprimés (11), au dessus de la zone (10) de la carte, exigeant une bonne qualité de transmission. Un intervalle d'air (L) est obtenu entre le conducteur (5) et la carte à circuits imprimés (11). Des joints à souder (21) relient chacune des parties externes (7a, 7b) du conducteur (5) du composant (1) à des tracés conducteurs (17a, 17b) de la carte à circuits imprimés (11). L'épaisseur des connexions à souder et l'épaisseur des tracés conducteurs forment l'intervalle d'air (L) entre le conducteur (5) et la carte à circuits imprimés (11). Dans une variante de l'invention, une rainure (23) est creusée sous le conducteur (5) dans la carte à circuits imprimés (11). On obtient ainsi un intervalle d'air agrandi entre le conducteur (5) et la carte à circuits imprimés (11).
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