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1. WO1999003130 - HEAT-TRANSFER ENHANCING FEATURES FOR SEMICONDUCTOR CARRIERS AND DEVICES

Publication Number WO/1999/003130
Publication Date 21.01.1999
International Application No. PCT/US1998/011066
International Filing Date 01.06.1998
Chapter 2 Demand Filed 08.02.1999
IPC
G01R 31/28 2006.1
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
H01L 21/673 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
673using specially adapted carriers
H01L 21/68 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68for positioning, orientation or alignment
CPC
G01R 31/2867
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
2851Testing of integrated circuits [IC]
2855Environmental, reliability or burn-in testing
286External aspects, e.g. related to chambers, contacting devices or handlers
2865Holding devices, e.g. chucks; Handlers or transport devices
2867Handlers or transport devices, e.g. loaders, carriers, trays
G01R 31/2874
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
2851Testing of integrated circuits [IC]
2855Environmental, reliability or burn-in testing
2872related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
2874related to temperature
H01L 21/67333
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
673using specially adapted carriers ; or holders; Fixing the workpieces on such carriers or holders
67333Trays for chips
H01L 21/67336
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
673using specially adapted carriers ; or holders; Fixing the workpieces on such carriers or holders
67333Trays for chips
67336characterized by a material, a roughness, a coating or the like
H01L 21/6835
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
6835using temporarily an auxiliary support
H01L 2221/68313
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2221Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
683for supporting or gripping
68304using temporarily an auxiliary support
68313Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
Applicants
  • KINETRIX, INC. [US]/[US]
Inventors
  • PFAHNL, Andreas, C.
  • SLOCUM, Alexander, H.
  • LIENHARD, John, H., V
Agents
  • GAMACHE, Richard, E.
  • WALSH, Edmund, J.
Priority Data
08/890,91710.07.1997US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) HEAT-TRANSFER ENHANCING FEATURES FOR SEMICONDUCTOR CARRIERS AND DEVICES
(FR) ACCESSOIRES D'AMELIORATION DU TRANSFERT THERMIQUE POUR SUPPORTS ET DISPOSITIFS A SEMI-CONDUCTEUR
Abstract
(EN) Convective heat transfer enhancement features are formed in trays for carrying and thermally conditioning semiconductor devices or on integrated circuit chip packages. Upward extending ribs, perpendicular to a fluid flow, are formed in the trays and/or packages for increasing the mixing of the fluid flow near the devices under test, thereby enhancing convective heat transfer to or from the devices. Downward extending ribs are also formed in the trays and/or packages. The upward and downward extending ribs formed in the trays are in a staggered relationship for facilitating the stacking of trays. Alternatively, a surface roughness is applied to the trays and/or packages. The surface roughness applied to the packages is such that sufficient smooth regions remain on the packages for allowing pick-and-place machines to handle the packages.
(FR) L'invention concerne des accessoires destinés à améliorer le transfert de chaleur par convection, qui sont formés dans des plateaux destinés à transporter et à conditionner thermiquement des dispositifs à semi-conducteur, ou sur des boîtiers de puces. Des nervures dirigées vers le haut, perpendiculaires à un écoulement fluidique, sont formées dans les plateaux et/ou les boîtiers afin d'accroître le mélange dudit écoulement à proximité des dispositifs testés, ce qui améliore le transfert de chaleur par convection vers ou depuis lesdits dispositifs. Des nervures dirigées vers le bas sont également formées dans les plateaux et/ou les boîtiers. Dans les plateaux, les nervures dirigées vers le haut et celles dirigées vers le bas sont décalées, ce qui facilite l'empilement desdits plateaux. Dans un autre mode de réalisation, une rugosité de surface est créée sur les plateaux et/ou les boîtiers. Sur les boîtiers, la rugosité de surface est créée de façon à laisser des zones suffisamment lisses pour que les machines de manipulation puissent manipuler lesdits boîtiers.
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