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1. (WO1998053520) DEVICE FOR TRANSMITTING HIGH-FREQUENCY SIGNALS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1998/053520 International Application No.: PCT/DE1998/001262
Publication Date: 26.11.1998 International Filing Date: 06.05.1998
Chapter 2 Demand Filed: 28.10.1998
IPC:
H01P 3/08 (2006.01) ,H05K 1/02 (2006.01) ,H05K 1/03 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
P
WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3
Waveguides; Transmission lines of the waveguide type
02
with two longitudinal conductors
08
Microstrips; Strip lines
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants:
SIEMENS AKTIENGESELLSCHAFT [DE/DE]; Wittelsbacherplatz 2 D-80333 München, DE (AllExceptUS)
BRAND, Uwe [DE/DE]; DE (UsOnly)
TSCHERNITZ, Maximilian [DE/DE]; DE (UsOnly)
STEINHAUSER, Karl-August [DE/DE]; DE (UsOnly)
Inventors:
BRAND, Uwe; DE
TSCHERNITZ, Maximilian; DE
STEINHAUSER, Karl-August; DE
Priority Data:
197 21 087.220.05.1997DE
Title (DE) VORRICHTUNG ZUM ÜBERTRAGEN VON HOCHFREQUENTEN SIGNALEN
(EN) DEVICE FOR TRANSMITTING HIGH-FREQUENCY SIGNALS
(FR) DISPOSITIF POUR TRANSMETTRE DES SIGNAUX HAUTE FREQUENCE
Abstract:
(DE) Die Übertragung hochfrequenter Signale über auf herkömmlichen Leiterplatten fixierten Datenleitungen birgt beim Stand der Technik das Problem, dass die dort verwendeten unterschiedlichen Materialien unterschiedliche Signallaufzeiten bedingen. Dies hat seinen Grund darin, dass die Datenleitungen parallel zu den die Leiterplatte bildenden Glasfaserbündeln geführt werden. Erfindungsgemäss wird nun dafür Sorge getragen, dass die Datenleitungen unter einem vorgegebenen Winkel zu den Glasfaserbündeln geführt werden.
(EN) According to prior art, high-frequency signals transmitted via data lines fixed onto conventional conduction plates pose the problem of differing signal propagation times due to the different types of materials used thereon. This can be explained by the fact that the data lines are guided parallel to the optical fiber bundles which form the conduction plate. According to the invention, the data lines are fed to the optical fiber bundles at a predetermined angle.
(FR) Dans la technique antérieure, la transmission de signaux haute fréquence sur des lignes de données fixées sur des cartes de circuits classiques pose un problème car les différents matériaux employés dans ce cas conditionnent différents temps de propagation des signaux. Ce problème est dû au fait que les lignes de données sont guidées parallèlement aux faisceaux de fibres de verre formant la carte de circuit. Selon l'invention, il est prévu de guider les lignes de données selon un angle prédéterminé par rapport aux faisceaux de fibres de verre.
front page image
Designated States: CA, US
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: German (DE)
Filing Language: German (DE)
Also published as:
EP0983617US6304700CA2290562