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1. (WO1998053485) BUMP FORMING METHOD AND BUMP BONDER
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1998/053485 International Application No.: PCT/JP1998/002253
Publication Date: 26.11.1998 International Filing Date: 21.05.1998
Chapter 2 Demand Filed: 09.10.1998
IPC:
B23K 20/00 (2006.01) ,H01L 21/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20
Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Applicants:
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP/JP]; Kadoma-shi 1006, Oaza Kadoma Osaka 571-0050, JP (AllExceptUS)
MAE, Takaharu [JP/JP]; JP (UsOnly)
MAYAHARA, Kiyoshi [JP/JP]; JP (UsOnly)
NARITA, Shoriki [JP/JP]; JP (UsOnly)
WATANABE, Masaya [JP/JP]; JP (UsOnly)
TAKAKURA, Yuichi [JP/JP]; JP (UsOnly)
IKEYA, Masahiko [JP/JP]; JP (UsOnly)
Inventors:
MAE, Takaharu; JP
MAYAHARA, Kiyoshi; JP
NARITA, Shoriki; JP
WATANABE, Masaya; JP
TAKAKURA, Yuichi; JP
IKEYA, Masahiko; JP
Agent:
ISHIHARA, Masaru; Fujiwara Building, 5th floor 13-2, Kyomachi-bori 1-chome Nishi-ku, Osaka-shi Osaka 550-0003, JP
Priority Data:
9/13391723.05.1997JP
Title (EN) BUMP FORMING METHOD AND BUMP BONDER
(FR) CONTACT A BOSSES ET PROCEDE DE REALISATION
Abstract:
(EN) A bump forming method comprising a first step of forming a ball (5) at a distal end of a wire (4) which protrudes from a lower end of a capillary (12); a second step of opening a clamper (11) which securely holds the wire (4) above the capillary (12) and bringing down the capillary (12) as well as the clamper (11), in which an amount of movement of the clamper (11) is smaller than that of the capillary (12) by such an amount as to be equivalent to a length of the wire (4) being protruded from the lower end of the capillary (12) in the first step; a third step of forming a bump (21) from the ball (5) by bonding; and a fourth step of separating the wire (4) from the bump (21) by closing the clamper (11) and lifting up the clamper (11) and the capillary (21) to an initial position of the first step as well as causing a distal end of the wire (4) to protrude from the lower end of the capillary (12) by a predetermined length, whereby a step of drawing out a leading end of the wire (4) from the capillary (12) is eliminated.
(FR) Ce procédé de formation des bosses de contact comporte plusieurs opérations. La première opération consiste à former une bille (5) à l'extrémité distale d'un fil (4) qui dépasse par l'extrémité inférieure d'un tube capillaire (12). La deuxième opération consiste à ouvrir une pince (11) qui maintient fermement le fil (4) au-dessus du tube capillaire (12) et à faire descendre le tube capillaire (12) et la pince (11), le déplacement de la pince (11) étant inférieur au déplacement du tube capillaire (12). La différence de déplacement correspond à la longueur de fil (4) dépassant en dessous de l'extrémité inférieure d'un tube capillaire (12) pendant la première opération. La troisième opération consiste à former la bosse (21) à partir de la bille (5) en la faisant adhérer. La quatrième opération consiste à séparer le fil (4) de la bosse (21), d'une part en fermant la pince (11) et en relevant la pince (11) et le tube capillaire (21) jusqu'aux positions initiales de la première opération, et d'autre part en amenant l'extrémité distale du fil (4) à dépasser par l'extrémité inférieure du tube capillaire (12) d'une longueur définie. On élimine ainsi l'opération consistant à tirer sur l'extrémité d'introduction du fil (4) pour le faire sortir du tube capillaire (12).
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Designated States: KR, US
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020010012872EP0983607US6098868