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1. (WO1998053482) APPARATUS FOR COUPLING POWER THROUGH A WORKPIECE IN A SEMICONDUCTOR WAFER PROCESSING SYSTEM
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1998/053482 International Application No.: PCT/US1998/010770
Publication Date: 26.11.1998 International Filing Date: 21.05.1998
Chapter 2 Demand Filed: 22.12.1998
IPC:
H01J 37/32 (2006.01) ,H01J 37/34 (2006.01) ,H01L 21/67 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
J
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32
Gas-filled discharge tubes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
J
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32
Gas-filled discharge tubes
34
operating with cathodic sputtering
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
Applicants:
APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, CA 95054, US
Inventors:
VAN GOGH, James; US
Agent:
MOSER, Raymond, R., Jr. ; Applied Materials, Inc. P.O. Box 450A Santa Clara, CA 95052, US
Priority Data:
08/862,27223.05.1997US
Title (EN) APPARATUS FOR COUPLING POWER THROUGH A WORKPIECE IN A SEMICONDUCTOR WAFER PROCESSING SYSTEM
(FR) APPAREIL PERMETTANT LE COUPLAGE DE PUISSANCE A TRAVERS UNE PIECE DANS UN SYSTEME DE TRAITEMENT DE PLAQUETTES A SEMI-CONDUCTEUR
Abstract:
(EN) Apparatus for supporting a wafer in a semiconductor wafer processing system. The apparatus contains a pedestal assembly, a ring assembly circumscribing the pedestal and an insulator between the pedestal assembly and ring assembly. The insulator electrically isolates the pedestal assembly from the ring assembly thereby preventing unwanted power coupling through the ring assembly.
(FR) La présente invention concerne un appareil destiné à supporter une plaquette dans un système de traitement de plaquettes à semi-conducteur. L'appareil contient un ensemble socle, un ensemble anneau entourant le socle et un isolant entre l'ensemble socle et l'ensemble anneau. L'isolant isole électriquement l'ensemble socle de l'ensemble anneau et empêche de la sorte tout couplage de puissance non désiré à travers l'ensemble anneau.
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Designated States: JP, KR
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020010012878EP1012869JP2002502550