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1. (WO1998053236) LOW-POWER THERMOPNEUMATIC MICROVALVE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1998/053236 International Application No.: PCT/US1998/010410
Publication Date: 26.11.1998 International Filing Date: 20.05.1998
Chapter 2 Demand Filed: 21.12.1998
IPC:
F15C 5/00 (2006.01) ,F16K 31/00 (2006.01) ,F16K 31/126 (2006.01) ,F25B 41/06 (2006.01)
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
15
FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
C
FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
5
Manufacture of fluid-circuit elements; Manufacture of assemblages of such elements
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16
ENGINEERING ELEMENTS OR UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
K
VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
31
Operating means; Releasing devices
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16
ENGINEERING ELEMENTS OR UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
K
VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
31
Operating means; Releasing devices
12
actuated by fluid
126
the fluid acting on a diaphragm, bellows, or the like
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
25
REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION OR SOLIDIFICATION OF GASES
B
REFRIGERATION MACHINES, PLANTS, OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
41
Fluid-circulation arrangements, e.g. for transferring liquid from evaporator to boiler
06
Flow restrictors, e.g. capillary tubes; Disposition thereof
Applicants:
REDWOOD MICROSYSTEMS, INC. [US/US]; 1020 Hamilton Court Menlo Park, CA 94025, US
Inventors:
HENNING, Albert, Karl; US
ZDEBLICK, Mark; US
FITCH, John, Stuart; US
HOPKINS, Dean, Allyn, Jr.; US
LILLY, Leslie, Joe; US
Agent:
GALLIANI, William, S. ; Pennie & Edmonds LLP 1155 Avenue of the Americas New York, NY 10036, US
Priority Data:
60/047,34621.05.1997US
Title (EN) LOW-POWER THERMOPNEUMATIC MICROVALVE
(FR) MICROSOUPAPE THERMOPNEUMATIQUE A FAIBLE PUISSANCE
Abstract:
(EN) A thermopneumatic valve comprises a fluid channel plate (30) defining a fluid port. A diaphragm plate (28) is attached to the fluid channel plate. The diaphragm plate includes a displaceable diaphragm (44) to selectively obstruct the fluid port of the fluid channel plate. A thermal isolating heater (22) is connected to the diaphragm plate. The thermal isolating heater includes a thermal isolating heater body with a heating surface, a perimeter wall defining an extended axial cavity to confine a thermopneumatic working fluid (40) that is used to control the position of the displaceable diaphragm and a diaphragm obstruction structure (46) to limit the motion of the displaceable diaphragm into the extended axial cavity.
(FR) La présente invention concerne une soupape thermopneumatique comprenant une plaque canal de fluide (30) définissant un orifice de fluide. Une plaque diaphragme (28) est fixée à la plaque canal de fluide. La plaque canal comprend un diaphragme mobile (44) destiné à obturer, de manière sélective, l'orifice de fluide de la plaque canal de fluide. Un élément de chauffage isolant thermique (22) est relié à la plaque diaphragme. L'élément de chauffage isolant thermique comprend un corps d'élément de chauffage isolant thermique constitué d'une surface de chauffage, une paroi périphérique définissant une cavité axiale étendue, destinée à confiner un fluide de travail thermopneumatique (40) utilisé pour commander la position du diaphragme mobile et une structure d'obstruction de diaphragme (46) destinée à limiter le déplacement dudit diaphragme mobile dans la cavité axiale étendue.
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Designated States: JP
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP0981710JP2002504977