Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO1998052772) FLEXIBLE IC MODULE AND METHOD OF ITS MANUFACTURE, AND METHOD OF MANUFACTURING INFORMATION CARRIER COMPRISING FLEXIBLE IC MODULE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1998/052772 International Application No.: PCT/JP1998/002180
Publication Date: 26.11.1998 International Filing Date: 18.05.1998
IPC:
G06K 19/077 (2006.01) ,H05K 1/03 (2006.01) ,H05K 1/18 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19
Record carriers for use with machines and with at least a part designed to carry digital markings
06
characterised by the kind of the digital marking, e.g. shape, nature, code
067
Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07
with integrated circuit chips
077
Constructional details, e.g. mounting of circuits in the carrier
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
Applicants:
HITACHI MAXELL, LTD. [JP/JP]; 1-88, Ushitora 1-chome Ibaraki-shi Osaka 567-8567, JP (AllExceptUS)
KOHAMA, Kyoichi [JP/JP]; JP (UsOnly)
HIRAI, Yusuke [JP/JP]; JP (UsOnly)
TAMADA, Kaname [JP/JP]; JP (UsOnly)
SUEYOSHI, Toshinobu [JP/JP]; JP (UsOnly)
FUKAO, Ryuzo [JP/JP]; JP (UsOnly)
DAIDO, Kazuhiko [JP/JP]; JP (UsOnly)
Inventors:
KOHAMA, Kyoichi; JP
HIRAI, Yusuke; JP
TAMADA, Kaname; JP
SUEYOSHI, Toshinobu; JP
FUKAO, Ryuzo; JP
DAIDO, Kazuhiko; JP
Agent:
ASAMURA, Kiyoshi ; New Ohtemachi Building Room 331 2-1, Ohtemachi 2-chome Chiyoda-ku Tokyo 100-0004, JP
Priority Data:
10/671416.01.1998JP
9/12861219.05.1997JP
9/16361420.06.1997JP
Title (EN) FLEXIBLE IC MODULE AND METHOD OF ITS MANUFACTURE, AND METHOD OF MANUFACTURING INFORMATION CARRIER COMPRISING FLEXIBLE IC MODULE
(FR) MODULE DE CIRCUIT INTEGRE FLEXIBLE ET SON PROCEDE DE PRODUCTION, PROCEDE DE PRODUCTION DE SUPPORT D'INFORMATION COMPRENANT LEDIT MODULE
Abstract:
(EN) A flexible IC module which can be utilized to manufacture a noncontact IC card, etc.; a method of manufacturing the flexible IC module; and a method of manufacturing an information carrier comprising such a flexible IC module. An IC chip (1) and a coil (2) are buried in a flexible substrate (3) made from nonwoven fabric, etc., having compressibility in the direction of the thickness, self-contact-bondability and resin impregnability. The flexible IC module can be manufactured according to the following procedure: 1) a 1st nonwoven fabric (12) having compressibility in the direction of the thickness, self-contact-bondability and resin impregnability is placed on a lower die (11); 2) an IC chip (1) and a coil (2) are placed and positioned on the 1st nonwoven fabric; 3) a 2nd nonwoven fabric (13) is put on the IC chip and the coil; and 4) the 2nd nonwoven fabric (13) is pressed with an upper die (14), and the 1st and 2nd nonwoven fabrics, the IC chip and the coil are unified by hot-pressing.
(FR) L'invention concerne un module de circuit intégré flexible pouvant être utilisé pour produire une carte de circuit intégré sans contact, etc.; elle concerne également un procédé de production dudit module ainsi qu'un procédé de production de support d'information comprenant ledit module. Un puce (1) et une bobine (2) sont noyées dans un substrat flexible (3) constitué d'un non tissé, etc. pouvant être comprimé dans la direction de l'épaisseur, soudé par autocontact et imprégné de résine. Ce module de circuit intégré flexible peut être produit de la manière suivante: 1) un premier non tissé (12) pouvant être comprimé dans la direction de l'épaisseur, soudé par autocontact et imprégné de résine, est placé sur une matrice inférieure (11); 2) une puce (1) et une bobine (2) sont placées et positionnées dans le premier non tissé; 3) un second non tissé (13) est placé sur la puce et la bobine; et 4) le second non tissé (13) est comprimé avec une matrice supérieure (14), et le premier et le second non tissé, la puce et la bobine sont réunis par pressage à chaud.
front page image
Designated States: AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CU, CZ, DE, DK, EE, ES, FI, GB, GE, GH, GM, GW, HU, ID, IL, IS, KE, KG, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, UA, UG, US, UZ, VN, YU, ZW
African Regional Intellectual Property Organization (ARIPO) (GH, GM, KE, LS, MW, SD, SZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
EP0913268US6412701CN1226858AU1998072390