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1. (WO1998052772) FLEXIBLE IC MODULE AND METHOD OF ITS MANUFACTURE, AND METHOD OF MANUFACTURING INFORMATION CARRIER COMPRISING FLEXIBLE IC MODULE

Pub. No.:    WO/1998/052772    International Application No.:    PCT/JP1998/002180
Publication Date: Fri Nov 27 00:59:59 CET 1998 International Filing Date: Tue May 19 01:59:59 CEST 1998
IPC: G06K 19/077
H05K 1/03
H05K 1/18
Applicants: HITACHI MAXELL, LTD.

KOHAMA, Kyoichi

HIRAI, Yusuke

TAMADA, Kaname

SUEYOSHI, Toshinobu

FUKAO, Ryuzo

DAIDO, Kazuhiko

Inventors: KOHAMA, Kyoichi

HIRAI, Yusuke

TAMADA, Kaname

SUEYOSHI, Toshinobu

FUKAO, Ryuzo

DAIDO, Kazuhiko

Title: FLEXIBLE IC MODULE AND METHOD OF ITS MANUFACTURE, AND METHOD OF MANUFACTURING INFORMATION CARRIER COMPRISING FLEXIBLE IC MODULE
Abstract:
A flexible IC module which can be utilized to manufacture a noncontact IC card, etc.; a method of manufacturing the flexible IC module; and a method of manufacturing an information carrier comprising such a flexible IC module. An IC chip (1) and a coil (2) are buried in a flexible substrate (3) made from nonwoven fabric, etc., having compressibility in the direction of the thickness, self-contact-bondability and resin impregnability. The flexible IC module can be manufactured according to the following procedure: 1) a 1st nonwoven fabric (12) having compressibility in the direction of the thickness, self-contact-bondability and resin impregnability is placed on a lower die (11); 2) an IC chip (1) and a coil (2) are placed and positioned on the 1st nonwoven fabric; 3) a 2nd nonwoven fabric (13) is put on the IC chip and the coil; and 4) the 2nd nonwoven fabric (13) is pressed with an upper die (14), and the 1st and 2nd nonwoven fabrics, the IC chip and the coil are unified by hot-pressing.