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Machine translation
1. (WO1998052399) APPARATUS AND METHOD FOR MOUNTING ELECTRONIC PARTS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1998/052399    International Application No.:    PCT/JP1998/002164
Publication Date: 19.11.1998 International Filing Date: 15.05.1998
IPC:
H05K 13/02 (2006.01), H05K 13/04 (2006.01)
Applicants: SONY CORPORATION [JP/JP]; 7-35, Kitashinagawa 6-chome Shinagawa-ku Tokyo 141-0001 (JP) (For All Designated States Except US).
SUGIYAMA, Osamu [JP/JP]; (JP) (For US Only)
Inventors: SUGIYAMA, Osamu; (JP)
Agent: KOIKE, Akira; No.11 Mori Building 6-4, Toranomon 2-chome Minato-ku Tokyo 105-0001 (JP)
Priority Data:
9/126572 16.05.1997 JP
9/149597 06.06.1997 JP
9/274155 07.10.1997 JP
9/278545 13.10.1997 JP
9/278546 13.10.1997 JP
Title (EN) APPARATUS AND METHOD FOR MOUNTING ELECTRONIC PARTS
(FR) DISPOSITIF ET PROCEDE SERVANT A MONTER DES COMPOSANTS ELECTRONIQUES
Abstract: front page image
(EN)An apparatus for mounting electronic parts on a printed circuit board. Electronic parts to be mounted on a printed circuit board are loaded into a set of electronic parts mounting members according to the type of the electronic parts. The electronic parts mounting members are arranged in a mounting member supplying case. The set of electronic parts mounting members arranged and held in the case are inserted into and held in a mounting member holder that is capable of holding the set of electronic parts mounting members in such a manner as to correspond to an electronic parts mounting section of the printed circuit board. The mounting member holder is attached to an electronic parts mounter. The set of electronic parts is mounted on the printed circuit board at once by the mounter.
(FR)Dispositif servant à monter des composants électroniques sur une carte de circuit imprimé. On charge ces composants électroniques à monter sur la carte de circuit imprimé dans un ensemble d'éléments de montage de composants électroniques en fonction du type de ces composants. On dispose ces éléments de montage dans un boîtier d'alimentation en éléments de montage. On introduit l'ensemble d'éléments de montage disposés et maintenus dans le boîtier dans un support d'éléments de montage, dans lequel ces derniers sont maintenus, capable de contenir cet ensemble, de façon qu'il corresponde à une section de montage des composants électroniques de la carte de circuit imprimé. On fixe ce support à un appareil de montage de composants électroniques. On monte l'ensemble de composants électroniques sur la carte de circuit imprimé en une seule fois au moyen de l'appareil de montage.
Designated States: CN, JP, KR, US.
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)