Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO1998052393) SURFACE MOUNT POWER SUPPLY DEVICE
Note: Text based on automatic Optical Character Recognition processes. Please use the PDF version for legal matters

What is claimed is:
1. A method for manufacturing a surface mount device, comprising the steps of:
mounting a component to a printed circuit board; and
mounting a lead frame attach having a plurality of vertically-extending pins to the printed circuit board.
2. The method of claim 1 , wherein the lead frame attach is comprised of thermal plastic.
3. The method of claim 1 , wherein the printed circuit board is comprised of T-LAMâ„¢.
4. The method of claim 1 , further comprising the step of coating the printed circuit board with a conformal coating.
5. The method of claim 1 , wherein the lead frame attach further comprises a cylindrical member positioned at a center of the lead frame attach.
6. The method of claim 1 , wherein the lead frame attach is rectangular.
7. A surface mount device, comprising,
a printed circuit board having at least one component disposed thereon; and
a lead frame attach having a plurality of vertically extending pins embedded thereon mounted to said PCB.
8. The surface mount device of claim 7, wherein the printed circuit board is comprised of T-LAMâ„¢.
9. The surface mount device of claim 7, wherein the lead frame attach is comprised of thermal plastic.
10. The surface mount device of claim 7, wherein the lead frame attach is rectangular.
11. The surface mount device of claim 7, wherein the lead frame attach further comprises a cylindrical member positioned at a center of the lead frame attach.