Search International and National Patent Collections

1. (WO1998052391) METHODS OF FIXTURING FLEXIBLE CIRCUIT SUBSTRATES AND A PROCESSING CARRIER, AND PROCESSING A FLEXIBLE CIRCUIT

Pub. No.:    WO/1998/052391    International Application No.:    PCT/US1998/010044
Publication Date: Fri Nov 20 00:59:59 CET 1998 International Filing Date: Sat May 16 01:59:59 CEST 1998
IPC: H05K 1/00
H05K 3/00
Applicants: MICRON COMMUNICATIONS, INC.
Inventors: LAKE, Rickie, C.
TUTTLE, Mark, E.
MOUSSEAU, Joseph, P.
CIRINO, Clay, L.
Title: METHODS OF FIXTURING FLEXIBLE CIRCUIT SUBSTRATES AND A PROCESSING CARRIER, AND PROCESSING A FLEXIBLE CIRCUIT
Abstract:
Methods of fixturing a flexible circuit substrate (20) to a processing carrier (60) are disclosed. In one implementation, the flexible circuit substrate (20) and processing carrier (60) are attached with an adhesive film (40) provided therebetween. The adhesive film (40) comprises acrylic, silicone or a silicone acrylic blend in a preferred embodiment of the present invention. Ideally, substantially the total surface area of a first surface (22) of the flexible circuit substrate (20) is attached to the processing carrier (60). The flexible circuit substrate (20) is removed from the adhesive film (40) following processing thereof. In a preferred embodiment of the present invention, the adhesive film (40) is monolithic. An electrical component (36) is attached to the flexible circuit substrate (20) and the flexible circuit substrate (20) is encapsulated in accordance with one implementation of the present invention.