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1. (WO1998052391) METHODS OF FIXTURING FLEXIBLE CIRCUIT SUBSTRATES AND A PROCESSING CARRIER, AND PROCESSING A FLEXIBLE CIRCUIT
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1998/052391 International Application No.: PCT/US1998/010044
Publication Date: 19.11.1998 International Filing Date: 15.05.1998
Chapter 2 Demand Filed: 16.12.1998
IPC:
H05K 1/00 (2006.01) ,H05K 3/00 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
Applicants:
MICRON COMMUNICATIONS, INC. [US/US]; 8000 South Federal Way Boise, ID 83706-9632, US
Inventors:
LAKE, Rickie, C.; US
TUTTLE, Mark, E.; US
MOUSSEAU, Joseph, P.; US
CIRINO, Clay, L.; US
Agent:
SHAURETTE, James, D. ; Wells, St. John, Roberts, Gregory & Matkin, P.S. W. 601 First Avenue #1300 Spokane, WA 99201-3817, US
Priority Data:
08/858,02116.05.1997US
Title (EN) METHODS OF FIXTURING FLEXIBLE CIRCUIT SUBSTRATES AND A PROCESSING CARRIER, AND PROCESSING A FLEXIBLE CIRCUIT
(FR) PROCEDES PERMETTANT DE FIXER DES SUBSTRATS DE CIRCUIT SOUPLE ET SUPPORT DE TRAITEMENT, AINSI QUE TRAITEMENT D'UN CIRCUIT SOUPLE
Abstract:
(EN) Methods of fixturing a flexible circuit substrate (20) to a processing carrier (60) are disclosed. In one implementation, the flexible circuit substrate (20) and processing carrier (60) are attached with an adhesive film (40) provided therebetween. The adhesive film (40) comprises acrylic, silicone or a silicone acrylic blend in a preferred embodiment of the present invention. Ideally, substantially the total surface area of a first surface (22) of the flexible circuit substrate (20) is attached to the processing carrier (60). The flexible circuit substrate (20) is removed from the adhesive film (40) following processing thereof. In a preferred embodiment of the present invention, the adhesive film (40) is monolithic. An electrical component (36) is attached to the flexible circuit substrate (20) and the flexible circuit substrate (20) is encapsulated in accordance with one implementation of the present invention.
(FR) Procédés de fixation d'un substrat (20) de circuit souple sur un support (60) de traitement. Dans un mode de réalisation, le substrat (20) de circuit souple et le support (60) de traitement sont fixés l'un à l'autre par l'intermédiaire d'un film adhésif (40) situé entre eux. Dans un mode de réalisation préféré, le film adhésif (40) comprend de l'acrylique, du silicone ou un mélange de ces deux substances. Idéalement, la superficie totale (22) d'une première surface du substrat (20) est collée au support (60) de traitement. Après traitement, le substrat (20) est détaché du film adhésif (40). Dans un mode de réalisation préféré, le film adhésif (40) est monolithique. Un composant électrique (36) est attaché au substrat (20) de circuit souple et ledit substrat (20) est encapsulé selon un mode de réalisation de la présente invention.
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Designated States: AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CU, CZ, DE, DK, EE, ES, FI, GB, GE, GH, GM, GW, HU, ID, IL, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, UA, UG, UZ, VN, YU, ZW
African Regional Intellectual Property Organization (ARIPO) (GH, GM, KE, LS, MW, SD, SZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
AU1998073900