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1. (WO1998052280) PIEZOELECTRIC THIN FILM DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1998/052280 International Application No.: PCT/JP1997/001602
Publication Date: 19.11.1998 International Filing Date: 13.05.1997
Chapter 2 Demand Filed: 24.07.1998
IPC:
H03H 3/02 (2006.01) ,H03H 9/17 (2006.01)
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
3
Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
007
for the manufacture of electromechanical resonators or networks
02
for the manufacture of piezo-electric or electrostrictive resonators or networks
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9
Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
15
Constructional features of resonators consisting of piezo-electric or electrostrictive material
17
having a single resonator
Applicants:
MITSUBISHI DENKI KABUSHIKI KAISHA [JP/JP]; 2-3, Marunouchi 2-chome Chiyoda-ku Tokyo 100-8310, JP (AllExceptUS)
YAMADA, Akira [JP/JP]; JP (UsOnly)
MAEDA, Chisako [JP/JP]; JP (UsOnly)
UMEMURA, Toshio [JP/JP]; JP (UsOnly)
UCHIKAWA, Fusaoki [JP/JP]; JP (UsOnly)
MISU, Koichiro [JP/JP]; JP (UsOnly)
WADAKA, Shusou [JP/JP]; JP (UsOnly)
ISHIKAWA, Takahide [JP/JP]; JP (UsOnly)
Inventors:
YAMADA, Akira; JP
MAEDA, Chisako; JP
UMEMURA, Toshio; JP
UCHIKAWA, Fusaoki; JP
MISU, Koichiro; JP
WADAKA, Shusou; JP
ISHIKAWA, Takahide; JP
Agent:
AOYAMA, Tamotsu ; Aoyama & Partners IMP Building 3-7, Shiromi 1-chome Chuo-ku, Osaka-shi Osaka 540, JP
Priority Data:
Title (EN) PIEZOELECTRIC THIN FILM DEVICE
(FR) DISPOSITIF A COUCHE MINCE PIEZO-ELECTRIQUE
Abstract:
(EN) A piezoelectric thin film device which is composed mainly of a substrate, a piezoelectric thin film formed on the substrate, and thin film electrodes formed on both the upper and lower surfaces of the thin film. The thin film is resonated by applying an AC voltage across the electrodes. A substrate removed section is formed by partially or entirely removing the substrate below the thin film and opened to both the front and rear surfaces of the substrate through openings so as to relieve the pressure variation in the substrate removed section below a resonant structure.
(FR) L'invention concerne un dispositif à couche mince piézo-électrique comportant principalement un substrat, une couche mince piézo-électrique formée sur ce substrat, et des électrodes à couche mince formées sur les surfaces supérieure et inférieure de la couche mince. L'application d'une tension alternative aux électrodes permet de faire résonner la couche mince. L'enlèvement d'une section sur le substrat est réalisé par enlèvement partiel ou total du substrat au-dessous de la couche mince et ouverture des surfaces avant et arrière du substrat par l'intermédiaire de fenêtres de manière à libérer la variation de pression dans cette section ôtée du substrat, au-dessous d'une structure résonante.
Designated States: AU, JP, US
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
US6271619AU1997027125