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1. (WO1998052235) DIELECTRIC THIN FILM ELEMENT AND PROCESS FOR MANUFACTURING THE SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1998/052235 International Application No.: PCT/JP1998/002086
Publication Date: 19.11.1998 International Filing Date: 12.05.1998
Chapter 2 Demand Filed: 11.11.1998
IPC:
H01L 37/02 (2006.01) ,H01L 41/316 (2013.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
37
Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using Nernst-Ettinghausen effect; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof
02
using thermal change of dielectric constant, e.g. working above and below the Curie point
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41
Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
22
Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof
31
Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base
314
by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing
316
by vapour phase deposition
Applicants:
MITSUBISHI DENKI KABUSHIKI KAISHA [JP/JP]; 2-3, Marunouchi 2-chome Chiyoda-ku Tokyo 100-8310, JP (AllExceptUS)
MAEDA, Chisako [JP/JP]; JP (UsOnly)
YAMADA, Akira [JP/JP]; JP (UsOnly)
UMEMURA, Toshio [JP/JP]; JP (UsOnly)
UCHIKAWA, Fusaoki [JP/JP]; JP (UsOnly)
Inventors:
MAEDA, Chisako; JP
YAMADA, Akira; JP
UMEMURA, Toshio; JP
UCHIKAWA, Fusaoki; JP
Agent:
AOYAMA, Tamotsu ; Aoyama & Partners IMP Building 3-7, Shiromi 1-chome Chuo-ku, Osaka-shi Osaka 540-0001, JP
Priority Data:
PCT/JP97/0160113.05.1997US
Title (EN) DIELECTRIC THIN FILM ELEMENT AND PROCESS FOR MANUFACTURING THE SAME
(FR) ELEMENT DIELECTRIQUE A FILM MINCE ET PROCEDE DE FABRICATION DE CET ELEMENT
Abstract:
(EN) A process for manufacturing a plurality of dielectric thin film elements by forming an undercoating on a substrate, stacking a dielectric thin film on the undercoating, forming the dielectric thin film into a plurality of predetermined shapes, and if necessary forming an upper structure on each of the plurality of dielectric thin films, wherein the dielectric thin film is divisionally formed on the undercoating by using a mask after the undercoating is formed to have a stress in a direction opposite to that of the dielectric thin film, or alternatively the dielectric thin film is divided into predetermined shapes after being formed.
(FR) Cette invention se rapporte à un procédé servant à fabriquer plusieurs éléments diélectriques à film mince, en formant un revêtement inférieur sur un substrat, en empilant un film mince diélectrique sur ce revêtement inférieur, et en formant le film mince diélectrique sous plusieurs formes prédéterminées et, si nécessaire, en formant une structure supérieure sur chacun des minces films diélectriques, lequel se forme avec des divisions sur le revêtement inférieur, grâce à l'utilisation d'un masque, après avoir soumis le revêtement inférieur à une contrainte dans une direction opposée à celle du film mince diélectrique ou, dans une variante, celui-ci est divisé en formes prédéterminées après avoir été produit.
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Designated States: AU, JP, US
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
US6376889AU1998072358