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Machine translation
1. (WO1998052222) INTEGRATED PASSIVE COMPONENTS AND PACKAGE WITH POSTS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1998/052222    International Application No.:    PCT/US1998/009792
Publication Date: 19.11.1998 International Filing Date: 13.05.1998
Chapter 2 Demand Filed:    02.12.1998    
IPC:
H01L 23/485 (2006.01), H01L 27/08 (2006.01)
Applicants: CHIPSCALE, INC. [US/US]; 576 Charcot Avenue, San Jose, CA 95131 (US)
Inventors: MARCOUX, Phil, P.; (US).
YOUNG, James, L.; (US).
CHEN, Changsheng; (US)
Agent: VINCENT, Lester, J.; Blakely, Sokoloff, Taylor & Zafman LLP, 7th floor, 12400 Wilshire Boulevard, Los Angeles, CA 90025 (US)
Priority Data:
08/855,105 13.05.1997 US
Title (EN) INTEGRATED PASSIVE COMPONENTS AND PACKAGE WITH POSTS
(FR) COMPOSANTS PASSIFS INTEGRES ET BOITIER COMPORTANT DES BORNES
Abstract: front page image
(EN)A method and apparatus for an electronic component package of a passive component using wafer level processing is provided. Posts are formed on the active side of the substrate of an electronic component. A conductive layer leads the contact areas of the electronic component to the tops of the posts. The conductive layer on the top of the posts acting as leads, attaching to traces on a printed circuit board.
(FR)L'invention concerne un procédé et un appareil d'encapsulation dans un composant électronique d'un composant passif par traitement au niveau de la plaquette. On forme des bornes sur la surface active du substrat d'un composant électronique. Une couche conductrice sert de connexion entre les zones de contact du composant électronique et les sommets des bornes. La couche conductrice au sommet des bornes agit comme une connexion, se fixant à des rubans sur une plaque de circuit imprimé.
Designated States: AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CU, CZ, DE, DK, EE, ES, FI, GB, GE, GH, GM, GW, HU, ID, IL, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, UA, UG, UZ, VN, YU, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, SD, SZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)