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1. (WO1998051436) APPARATUS FOR BREAKING CHIPS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1998/051436 International Application No.: PCT/SG1998/000033
Publication Date: 19.11.1998 International Filing Date: 07.05.1998
Chapter 2 Demand Filed: 01.12.1998
IPC:
B23B 27/14 (2006.01) ,B23B 27/22 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
B
TURNING; BORING
27
Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
14
Cutting tools of which the bits or tips are of special material
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
B
TURNING; BORING
27
Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
22
Cutting tools with chip-breaking equipment
Applicants:
NATIONAL UNIVERSITY OF SINGAPORE [SG/SG]; 10 Kent Ridge Crescent Singapore 119260, SG (AllExceptUS)
LI, Xiaoping [SG/SG]; SG (UsOnly)
Inventors:
LI, Xiaoping; SG
Agent:
GREENE-KELLY, James, Patrick; Lloyd Wise Tanjong Pagar P.O. Box 636 Singapore 910816, SG
Priority Data:
9701465-809.05.1997SG
Title (EN) APPARATUS FOR BREAKING CHIPS
(FR) APPAREIL DESTINE A BRISER LES COPEAUX
Abstract:
(EN) Apparatus for breaking chips is disclosed in which the chip generated during cutting is broken into small pieces by increasing the shear strain at the shear plane, which is the joint between the chip and the workpiece, until fracture occurs at the shear plane. This is achieved by forming a chip generated during cutting into a lever by guiding the chip using an arcuate surface (97) inclined to the tool cutting edge (19).
(FR) L'invention concerne un dispositif destiné à briser les copeaux, dans lequel les copeaux produits pendant la coupe sont brisés en petits fragments par augmentation de la contrainte de cisaillement au niveau du plan de cisaillement, qui est l'interface entre les copeaux et la pièce, jusqu'à l'apparition d'une fracture au niveau du plan de cisaillement. Pour ce faire, les copeaux générés pendant la coupe sont réalisés sous forme de levier en guidant le copeau à l'aide d'une surface incurvée (97) inclinée vers le bord de coupe (19) de l'outil.
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Designated States: AU, CA, CN, IL, JP, KR, SG, US
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
SG68869AU1998073566