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1. (WO1998051136) METHOD FOR METALLIZING AT LEAST ONE PRINTED CIRCUIT BOARD OR AT LEAST ONE PRESSED SCREEN AND AT LEAST ONE HYBRID
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1998/051136 International Application No.: PCT/DE1998/000336
Publication Date: 12.11.1998 International Filing Date: 06.02.1998
IPC:
H05K 1/14 (2006.01) ,H05K 3/00 (2006.01) ,H05K 3/36 (2006.01) ,H05K 3/40 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
14
Structural association of two or more printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
36
Assembling printed circuits with other printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
40
Forming printed elements for providing electric connections to or between printed circuits
Applicants:
ROBERT BOSCH GMBH [DE/DE]; Postfach 30 02 20 D-70442 Stuttgart, DE (AllExceptUS)
WIESA, Thomas [DE/DE]; DE (UsOnly)
Inventors:
WIESA, Thomas; DE
Priority Data:
197 19 235.107.05.1997DE
Title (DE) VERFAHREN ZUR KONTAKTIERUNG WENIGSTENS EINER LEITERPLATTE ODER WENIGSTENS EINES STANZGITTERS UND WENIGSTENS EINES HYBRIDS
(EN) METHOD FOR METALLIZING AT LEAST ONE PRINTED CIRCUIT BOARD OR AT LEAST ONE PRESSED SCREEN AND AT LEAST ONE HYBRID
(FR) PROCEDE DE METALLISATION D'AU MOINS UNE PLAQUETTE A CIRCUIT IMPRIME OU D'AU MOINS UN GRILLAGE ESTAMPE ET D'AU MOINS UN HYBRIDE
Abstract:
(DE) Ein Verfahren zur Kontaktierung wenigstens einer Leiterplatte oder wenigstens eines Stanzgitters und wenigstens eines Hybrids ist gekennzeichnet durch folgende Schritte: Ausbilden von Kontaktelementen in einer Kontaktierungsfolie; Positionieren der Kontaktierungsfolie über dem Hybrid derart, daß die Kontaktelemente an vorgegebenen Positionen zwischen Leiterbahnen des Hybrids und Leiterbahnen der Leiterplatte angeordnet sind; und Wegätzen wenigstens eines Teils der Kontaktierungsfolie derart, daß die Kontaktelemente wenigstens teilweise frei zugänglich sind.
(EN) The invention relates to a method for metallizing at least one printed circuit board and at least one pressed screen and at least one hybrid, comprising the following steps: forming contact elements using a metallizing foil; positioning said metallizing foil above the hybrid in such a way that the contact elements can be inserted into the places provided between the lead circuits of the hybrid and the lead circuits of the printed circuits board; and stripping at least part of the contact metallizing foil so as to enable, at least partly, access to said contact elements.
(FR) La présente invention concerne un procédé de métallisation d'au moins une plaquette à circuit imprimé ou d'au moins un grillage estampé et d'au moins un hybride, comprenant les étapes suivantes: formation d'éléments de contact dans une feuille de métallisation; positionnement de la feuille de métallisation au-dessus de l'hybride de telle manière que les éléments de contact soient disposés aux endroits prévus entre les circuits conducteurs de l'hybride et les circuits conducteurs de la plaquette à circuit imprimé; et décapage d'au moins une partie de la feuille de métallisation de telle manière que les éléments de contact soient au moins en partie accessibles.
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Designated States: JP, KR, US
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: German (DE)
Filing Language: German (DE)
Also published as:
KR1020000023581EP0929998US6197208JP2001504999