A process is disclosed for producing plastic cards with a layered structure in which are embedded a flat coil and a chip connected therewith. These components are set on a first web (10), upon which a second web (20) with passages (30) for receiving the components and at least one covering web are applied. The webs are laminated together into a finished web out of which plastic cards are punched. In order to simplify such a process, a second web (20) set on the first web (10) is retained on a selectable section of the first web by fixing points, while a passage for receiving the flat coil is cut in the second web. For that purpose, the fixing points are distributed in such a way on both sides of the web that they are arranged next to a section of the web which corresponds to the form of the flat coil. The flat coil is then inserted through the thus formed passage and set on the first web, and the chip is inserted into a web provided with a chip opening.