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1. (WO1998050598) METHOD OF REDUCING SPUTTERING BURN-IN TIME, MINIMIZING SPUTTERED PARTICULATE, AND TARGET ASSEMBLY THEREFOR
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1998/050598 International Application No.: PCT/US1998/008961
Publication Date: 12.11.1998 International Filing Date: 04.05.1998
Chapter 2 Demand Filed: 01.12.1998
IPC:
C23C 14/34 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
34
Sputtering
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard P.O. Box 58119 Santa Clara, CA 95052-8119, US
MATERIALS RESEARCH CORPORATION [US/US]; 560 Route 303 Orangeburg, NY 10962, US
Inventors:
DUNLOP, John, A.; US
GOLDSTEIN, Michael; US
FELDEWERTH, Gerald, B.; US
SHIM, Cari; US
SCHITTNY, Stephan; US
Agent:
POFFENBERGER, John, D.; Wood, Herron & Evans, L.L.P. 2700 Carew Tower Cincinnati, OH 45202, US
Priority Data:
08/850,70702.05.1997US
Title (EN) METHOD OF REDUCING SPUTTERING BURN-IN TIME, MINIMIZING SPUTTERED PARTICULATE, AND TARGET ASSEMBLY THEREFOR
(FR) TECHNIQUE VISANT A REDUIRE LE TEMPS DE FORMAGE D'UNE CIBLE POUR PULVERISATION, A MINIMISER LA QUANTITE PARTICULAIRE PULVERISEE, ET CIBLE A CET EFFET
Abstract:
(EN) A target (1) for sputtering is subjected to a surface treatment process and special packaging after target (1) manufacture for improved sputtering performance and process and yield by reducing particulates. The sputtering target (1) is first surface treated to remove oxides, impurities and contaminants. The surface treated target (1) is then covered with a metallic enclosure (5) and optionally, a passivating barrier layer. The metallic enclosure (5) protects the target surface from direct contact with subsequently employed packaging material such as plastic bags (23), thereby eliminating source of organic materials during sputtering operations. The surface treatment of the target (1) removes deformed material, smearing, twins, or burrs and the like from the target surface, reducing 'burn-in' or sputter conditioning time prior to production sputtering of thin films.
(FR) Cette cible (1) pour pulvérisation est soumise à un traitement de surface et à un emballage spécial après sa fabrication et ce, afin d'améliorer les performances du processus de pulvérisation et le rendement de celle-ci par réduction du matériau particulaire. On traite d'abord la surface de la cible pour pulvérisation (1) pour enlever les oxydes, les impuretés et les agents contaminants. Une fois cette cible (1) traitée en surface, on la recouvre d'une enveloppe métallique (5) et, éventuellement, d'une couche barrière de passivation. L'enveloppe métallique (5) protège la surface de la cible d'un contact direct avec le matériau d'emballage utilisé par la suite, des poches plastiques (23) notamment, ce qui supprime les sources de matières organiques durant les opérations de pulvérisation. Le traitement de surface de la cible (1), qui élimine de la surface de la cible le matériau déformé, les salissures, les macles ou les ébarbures et analogue, réduit le temps de formage ou temps de conditionnement avant la pulvérisation de films minces.
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Designated States: AU, CA, JP
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP0977905JP2002511115 CA2288987AU1998071752