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1. (WO1998050480) ADHESIVE COMPOSITIONS THAT ARE REMOVABLE AFTER THERMOSETTING
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1998/050480 International Application No.: PCT/US1997/007505
Publication Date: 12.11.1998 International Filing Date: 05.05.1997
Chapter 2 Demand Filed: 28.10.1998
IPC:
C09J 7/00 (2006.01) ,C09J 7/02 (2006.01) ,C09J 163/00 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
02
on carriers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163
Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Applicants:
MINNESOTA MINING AND MANUFACTURING COMPANY [US/US]; 3M Center P.O. Box 33427 Saint Paul, MN 55133-3427, US (AllExceptUS)
WAID, Robert, D. [US/US]; US (UsOnly)
Inventors:
WAID, Robert, D.; US
Agent:
SKOLNICK, Steven, E. ; Minnesota Mining and Manufacturing Company Office of Intellectual Property Counsel P.O. Box 33427 Saint Paul, MN 55133-3427, US
MEYERS Hans-Wilhelm; P.O. Box 102241 D-50462 Koln, DE
Priority Data:
Title (EN) ADHESIVE COMPOSITIONS THAT ARE REMOVABLE AFTER THERMOSETTING
(FR) COMPOSITIONS ADHESIVES ENLEVABLES APRES THERMODURCISSEMENT
Abstract:
(EN) Thermosettable adhesive compositions that include a polyepoxide resin, a curing agent, and a plurality of microspheres. The microspheres, polyepoxide resin, and curing agent and the relative amounts thereof, are selected such that upon cure the composition is capable of forming a semi-structural bond to a substrate and is cleanly thermally removable from the substrate.
(FR) L'invention concerne des compositions adhésives thermodurcissables comprenant une résine polyépoxy, un agent de polymérisation et une pluralité de microsphères. Les microsphères, la résine poylépoxy et l'agent de polymérisation, ainsi que les quantités relatives de ces derniers sont sélectionnés de telle sorte que lors de la polymérisation, la composition est capable de former une liaison semi-structurelle avec un substrat et peut être enlevée thermiquement du substrat sans laisser de traces.
Designated States: AU, CA, JP, KR, US
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP0980409US6288170JP2001523295 AU1997030584