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1. (WO1998050229) ADHESIVE COMPOSITE MATERIAL FOR OFFICE AUTOMATION MACHINES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1998/050229 International Application No.: PCT/JP1998/001940
Publication Date: 12.11.1998 International Filing Date: 27.04.1998
Chapter 2 Demand Filed: 09.10.1998
IPC:
C08F 214/18 (2006.01) ,C09D 127/18 (2006.01) ,C09J 127/12 (2006.01) ,G03G 15/02 (2006.01) ,G03G 15/16 (2006.01) ,G03G 15/20 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
214
Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
18
Monomers containing fluorine
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
D
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
127
Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
02
not modified by chemical after-treatment
12
containing fluorine atoms
18
Homopolymers or copolymers of tetrafluoroethene
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
127
Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
02
not modified by chemical after-treatment
12
containing fluorine atoms
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
G
ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
15
Apparatus for electrographic processes using a charge pattern
02
for laying down a uniform charge, e.g. for sensitising; Corona discharge devices
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
G
ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
15
Apparatus for electrographic processes using a charge pattern
14
for transferring a pattern to a second base
16
of a toner pattern, e.g. a powder pattern
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
G
ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
15
Apparatus for electrographic processes using a charge pattern
20
for fixing, e.g. by using heat
Applicants:
DAIKIN INDUSTRIES, LTD. [JP/JP]; Umeda Center Building 4-12, Nakazaki-nishi 2-chome Kita-ku Osaka-shi Osaka 530-8323, JP (AT, BE, CH, CN, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, JP, KR, LU, MC, NL, PT, SE)
ARAKI, Takayuki [JP/JP]; JP (UsOnly)
TANAKA, Yoshito [JP/JP]; JP (UsOnly)
KUMEGAWA, Masahiro [JP/JP]; JP (UsOnly)
OKA, Noritoshi [JP/JP]; JP (UsOnly)
SANEMASA, Hisato [JP/JP]; JP (UsOnly)
SHIMIZU, Tetsuo [JP/JP]; JP (UsOnly)
Inventors:
ARAKI, Takayuki; JP
TANAKA, Yoshito; JP
KUMEGAWA, Masahiro; JP
OKA, Noritoshi; JP
SANEMASA, Hisato; JP
SHIMIZU, Tetsuo; JP
Agent:
ASAHINA, Sohta ; NS Building 2-22, Tanimachi 2-chome Chuo-ku, Osaka-shi Osaka 540-0012, JP
Priority Data:
9/11398001.05.1997JP
Title (EN) ADHESIVE COMPOSITE MATERIAL FOR OFFICE AUTOMATION MACHINES
(FR) MATERIAU COMPOSITE ADHESIF POUR MACHINES AUTOMATIQUES DE BUREAU
Abstract:
(EN) An adhesive composite material for office automation machines which is excellent in heat resistance, adhesiveness, stainproofness, water- and oil-repellency, stain removing properties, chemical resistance, rustproofness, antimicrobial properties, actinic radiation resistance and wear resistance can be produced without any complicated step by applying to a substrate a material comprising a fluorinated copolymer excellent in adhesion to the substrate. Specifically, an adhesive composite material for office automation machines, produced by applying to a substrate a material comprising a fluorinated ethylenic copolymer prepared by copolymerizing (a) 0,05 to 30 mole % of at least one fluorinated ethylenic monomer having at least one functional group selected among hydroxyl, carboxyl, carboxylic salt, carboxylic ester and epoxy groups, with (b) 70 to 99.95 mole % of at least one fluorinated ethylenic monomer free from the above functional groups.
(FR) Matériau composite adhésif conçu pour des machines automatiques de bureau et présentant des caractéristiques excellentes de résistance à la chaleur, d'adhérence, de résistance contre les taches, d'imperméabilité à l'eau et à l'huile, de suppression de taches, de résistance chimique, anticorrosion et antimicrobienne, de résistance contre le rayonnement actinique et contre l'usure. On peut fabriquer ce matériau adhésif sans difficultés par application sur un substrat d'un matériau contenant un copolymère fluoré dont l'adhérence au substrat est excellente. Plus particulièrement, matériau composite adhésif pour machines automatiques de bureau fabriqué par application sur un substrat d'un matériau contenant un copolymère éthylénique fluoré préparé par copolymérisation de (a) 0,05 à 30 % molaire d'au moins un monomère éthylénique fluoré possédant au moins un groupe fonctionnel sélectionné dans hydroxyle, carboxyle, un sel carboxylique, un ester carboxylique et des groupes époxyde, avec (b) 70 à 99,95 % molaire d'au moins un monomère éthylénique fluoré exempt des groupes fonctionnels énoncés ci-dessus.
Designated States: CN, JP, KR, US
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
US6500537JP3822913