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1. (WO1998050216) METHOD AND APPARATUS FOR MOLDING PLASTIC PACKAGES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1998/050216 International Application No.: PCT/SG1998/000032
Publication Date: 12.11.1998 International Filing Date: 02.05.1998
Chapter 2 Demand Filed: 04.12.1998
IPC:
B29C 45/14 (2006.01) ,H01L 21/56 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
45
Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
14
incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
Applicants:
ADVANCED SYSTEMS AUTOMATION LIMITED [SG/SG]; 54 Serangoon North Ave. 4 Singapore 5558548, SG
Inventors:
CHEW, Hwee, Seng, Jimmy; SG
TAN, Peng, Hui; SG
Agent:
LAWRENCE Y.D. HO & ASSOCIATES; Thongsia Building 30 Bideford Road #07-01 Singapore 229922, SG
Priority Data:
9701389-006.05.1997SG
Title (EN) METHOD AND APPARATUS FOR MOLDING PLASTIC PACKAGES
(FR) PROCEDE ET APPAREIL DE MOULAGE DE BOITIERS EN PLASTIQUE
Abstract:
(EN) The present invention has a top mold, cavity plate and bottom mold for encapsulating a variety of BGA packages using a transfer molding process. The top mold features a network of runner for communicating with at least one spruce. The cavity plate has on the side facing the bottom mold at least one cavity for forming a mold over a substrate sandwiched there between when clamped. On the side of the cavity plate facing the top mold is at least one conical channel for receiving resin from the runner. The tip of the conical channel terminates in a submarine gate disposed in the centre of the cavity for introducing resin therein while minimising wire sweep. The network of runner and combination of conical channels encapsulates BGA packages in a variety of matrix reliably and economically.
(FR) La présente invention comprend un moule supérieur, une plaque de cavité et un moule inférieur permettant d'encapsuler divers boîtiers à matrices à grilles de boules utilisant un processus de moulage par transfert. Le moule supérieur comprend un réseau de goulotte permettant la communication avec au moins un goulot. La plaque de cavité comprend, sur une face tournée vers le moule inférieur, au moins une cavité permettant de former un moule sur un substrat pris en sandwich entre celles-ci, lorsqu'il est serré. Sur la face de la plaque de cavité tournée vers le moule supérieur se trouve au moins un canal conique destiné à recevoir la résine de la goulotte. La pointe du canal conique aboutit dans une entrée sous-marine disposée au centre de la cavité afin d'y introduire de la résine tout en réduisant au minimum le courbure des fils. Le réseau de goulotte et la combinaison des canaux coniques permettent d'encapsuler des boîtiers à matrices à grilles de boules dans diverses matrices de manière fiable et économique.
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Designated States: CA, CN, JP
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP0980305JP2001522526 CN1255082