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1. (WO1998050189) APPARATUS AND METHOD FOR FORMING SOLDER BONDING PADS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1998/050189 International Application No.: PCT/US1998/009162
Publication Date: 12.11.1998 International Filing Date: 05.05.1998
Chapter 2 Demand Filed: 24.11.1998
IPC:
B23K 3/06 (2006.01) ,B23K 35/02 (2006.01) ,H01L 21/68 (2006.01) ,H05K 3/34 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3
Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
06
Solder feeding devices; Solder melting pans
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
02
characterised by mechanical features, e.g. shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68
for positioning, orientation or alignment
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
Applicants:
SHAPIRO, Herbert, M. [US/US]; US
Inventors:
SHAPIRO, Herbert, M.; US
Agent:
DREYFUS, Edward; P.O. Box 5592 Clark, NJ 07066, US
Priority Data:
08/854,06408.05.1997US
08/877,27017.06.1997US
Title (EN) APPARATUS AND METHOD FOR FORMING SOLDER BONDING PADS
(FR) APPAREIL ET PROCEDE POUR FORMER DES POINTS DE SOUDURE
Abstract:
(EN) The placement of solder 'balls' in a Ball Grid Array is accomplished by placing a solder strip (73) in contact with the top surface of the ball grid array carrier. The pulsing of a laser directed at the solder (74) in discrete positions permits the transfer of the solder to the gold dot (70), of the array of dots, on the carrier (71) in registry with the laser output (82) when activated. Selective solder placement is possible and increasingly higher throughput is achieved by the use of laser diode bars (80) or optical fiber fans to effect solder transfer to a plurality of dots of the array simultaneously. The use of a transparent strip (73) with a pattern of holes filled with solder paste (74) permits easy transfer of the solder to the gold dots or islands (70) on the carrier (71) in registry with laser beam.
(FR) La mise en place de globules de soudure dans un réseau de globules s'effectue par la mise en place d'une bandelette (73) de soudure en contact avec la surface supérieure du support du réseau. Un laser pulsé dirigé sur la soudure (74) en des emplacements distincts permet le transfert de la soudure au point d'or (70), du réseau de points, sur le support (71) en alignement avec l'émission laser (82) lors de son activation. La mise en oeuvre de barrettes de diodes laser (80) ou de faisceaux de fibres optiques pour réaliser le transfert de soudure simultanément sur une pluralité de points du réseau permet la mise en place sélective de soudure et un rendement de plus en plus élevé. L'utilisation d'une bandelette (73) transparente pourvue d'une configuration de trous remplis de soudure en pâte (74) permet de transférer aisément la soudure aux points (70) ou ilôts d'or sur le support (71) en alignement avec le faisceau laser.
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Designated States: AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CU, CZ, DE, DK, EE, ES, FI, GB, GE, GH, GM, GW, HU, ID, IL, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, UA, UG, UZ, VN, YU, ZW
African Regional Intellectual Property Organization (ARIPO) (GH, GM, KE, LS, MW, SD, SZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
AU1998072871