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1. (WO1998049877) APPARATUS FOR MANUFACTURING ADHESIVE LAYER, APPARATUS FOR MANUFACTURING DOUBLE-SIDED SUBSTRATE, AND APPARATUS FOR MANUFACTURING MULTI-LAYERED SUBSTRATE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1998/049877 International Application No.: PCT/JP1998/001903
Publication Date: 05.11.1998 International Filing Date: 24.04.1998
IPC:
B32B 37/20 (2006.01) ,H05K 3/00 (2006.01) ,H05K 3/40 (2006.01) ,H05K 3/46 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
37
Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
14
characterised by the properties of the layers
16
with all layers existing as coherent layers before laminating
20
involving the assembly of continuous webs only
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
40
Forming printed elements for providing electric connections to or between printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
Applicants:
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP/JP]; 1006, Oaza Kadoma Kadoma-shi Osaka 571-0050, JP (CN, DE, FR, GB, SG)
OCHI, Akio [JP/JP]; JP (UsOnly)
KATO, Kanji [JP/JP]; JP (UsOnly)
TANIZAKI, Toshio [JP/JP]; JP (UsOnly)
WADA, Akira [JP/JP]; JP (UsOnly)
HAYASHI, Hidenori [JP/JP]; JP (UsOnly)
Inventors:
OCHI, Akio; JP
KATO, Kanji; JP
TANIZAKI, Toshio; JP
WADA, Akira; JP
HAYASHI, Hidenori; JP
Agent:
HAGINO, Taira ; Eikoh Patent Office ARK Mori Building, 28th floor 12-32, Akasaka 1-chome Minato-ku Tokyo 107-6028, JP
Priority Data:
9/10880525.04.1997JP
Title (EN) APPARATUS FOR MANUFACTURING ADHESIVE LAYER, APPARATUS FOR MANUFACTURING DOUBLE-SIDED SUBSTRATE, AND APPARATUS FOR MANUFACTURING MULTI-LAYERED SUBSTRATE
(FR) DISPOSITIF DE FABRICATION DE COUCHE ADHESIVE, DE SUBSTRAT DOUBLE FACE ET DE SUBSTRAT MULTI-COUCHE
Abstract:
(EN) An apparatus for manufacturing adhesive layers, double-sided substrates and multi-layered substrates, in which fine and high packaging efficiency is provided, no plating step is necessary, and manufacturing process steps are clean. An adhesive layer forming section (5) comprises a sticking unit (1), a hole making unit (2), a filling unit (3) and a peeling unit (4), while a double-sided substrate forming section (16) comprises a laminating unit (10), a resin curing unit (11) and a pattern forming unit (12) in addition to a sticking unit (6), a hole making unit (7), a filling unit (8) and a peeling unit (9). An apparatus for manufacturing multi-layered substrates comprises a multi-layer laminating unit (13), a resin curing unit (14) and an outer layer pattern forming unit (15) following the adhesive layer forming section (5) and the double-sided substrate forming section (16).
(FR) L'invention concerne un dispositif de fabrication de couches adhésives, de substrats double face et de substrats multi-couches, caractérisé par une grande efficacité et précision d'encapsulation, et avec lequel il n'est pas nécessaire d'exécuter un processus de placage, les étapes de fabrication s'effectuant en outre dans des conditions de salle blanche. Une section de formation (5) d'une couche adhésive comprend une unité d'encollage (1), une unité de formation (2) de trous, une unité de remplissage (3) et une unité de décollage (4), tandis qu'une section de formation (16) d'un substrat double face comporte une unité de stratification (10), une unité de durcissement (11) de résine, ainsi qu'une unité de formation (12) de motif, en plus d'une unité d'encollage (6), d'une unité de formation (7) de trous, d'une unité de remplissage (8) et d'une unité de décollage (4). Le dispositif de fabrication de substrats multi-couches comprend une unité de stratification (13) de plusieurs couches, une unité de durcissement (14) de résine, ainsi qu'une unité de formation (15) d'un motif sur une couche extérieure, toutes ces unités étant situées après la section de formation (5) d'une couche adhésive et la section de formation (16) d'un substrat double face.
front page image
Designated States: CN, SG, US
European Patent Office (DE, FR, GB)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
SG61005EP0928129US6164357JP10303555 CN1224568