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1. (WO1998049875) METHOD OF ATTACHING METALLIC OBJECTS TO A PRINTED CIRCUIT BOARD
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/1998/049875 International Application No.: PCT/US1998/004013
Publication Date: 05.11.1998 International Filing Date: 02.03.1998
Chapter 2 Demand Filed: 31.07.1998
IPC:
H05K 3/00 (2006.01) ,H05K 3/34 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
Applicants:
MOTOROLA INC. [US/US]; 1303 East Algonquin Road Schaumburg, IL 60196, US
Inventors:
MASTERTON, Patrick; US
Agent:
SONNENTAG, Richard, A. ; Motorola Inc. Intellectual Property Dept. 1303 East Algonquin Road Schaumburg, IL 60196, US
Priority Data:
08/846,36130.04.1997US
Title (EN) METHOD OF ATTACHING METALLIC OBJECTS TO A PRINTED CIRCUIT BOARD
(FR) PROCEDE DE FIXATION D'OBJETS METALLIQUES SUR UNE CARTE A CIRCUITS IMPRIMES
Abstract:
(EN) A single-step heating application for soldering a metallic flange (202) and other components (309) to a printed circuit board (201) is disclosed. Printed circuit board (201) includes one or more through apertures (203) where a solder paste (305) is dispensed, and is heated with metallic flange (202) and other components (309). The apertures (203) holding solder paste (305) have walls of non-metallic surfaces where solder is repelled during the heating process such that the solder flows to an area where the surfaces of metallic flange (202) and printed circuit board (201) are being soldered.
(FR) L'invention concerne une application de chaleur en une seule opération permettant de souder une semelle métallique (202) et d'autres composants (309) sur une carte (201) à circuits imprimés. La carte (201) comprend un ou plusieurs orifices (203) de passage à travers lesquels une soudure en pâte (309) est appliquée et est chauffée avec la semelle métallique (202) et les autres composants (309). Les orifices (203) contenant de la soudure en pâte (305) présentent des parois à surfaces non métalliques où la soudure est repoussée pendant le chauffage de façon à ce que la soudure s'écoule vers une zone où les surfaces de la semelle métallique (202) et la carte (201) à circuits imprimés sont soudées.
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Designated States: BR, CN, JP
Publication Language: English (EN)
Filing Language: English (EN)