Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO1998049727) RADIO FREQUENCY ELECTRONIC DEVICE FOR REGULATING AN AMOUNT OF POWER
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1998/049727 International Application No.: PCT/US1998/003260
Publication Date: 05.11.1998 International Filing Date: 20.02.1998
Chapter 2 Demand Filed: 31.07.1998
IPC:
H01L 23/473 (2006.01) ,H01L 23/495 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
46
involving the transfer of heat by flowing fluids
473
by flowing liquids
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
495
Lead-frames
Applicants:
MOTOROLA INC. [US/US]; 1303 East Algonquin Road Schaumburg, IL 60196, US
Inventors:
MCDUNN, Kevin, J.; US
LIMPER-BRENNER, Linda; US
Agent:
CREPS, Heather, L. ; Motorola Inc. Intellectual Property Dept. 1303 East Algonquin Road Schaumburg, IL 60196, US
Priority Data:
08/848,33430.04.1997US
Title (EN) RADIO FREQUENCY ELECTRONIC DEVICE FOR REGULATING AN AMOUNT OF POWER
(FR) DISPOSITIF ELECTRONIQUE DE FREQUENCE RADIO PERMETTANT DE REGULER UNE QUANTITE DE PUISSANCE
Abstract:
(EN) The device (10) includes a semiconductor die (12) positioned to receive a fluid cooling medium (45) and a power input lead (25) attached to the semiconductor die. The power input lead having a characteristic such that at a first temperature a first current flows between the semiconductor die and the power input lead and at a second temperature a second current flows between the semiconductor die and the power input lead.
(FR) Le dispositif (10) comprend une puce (12) de semi-conducteur placée de manière à recevoir un support (45) de refroidissement par liquide et un conducteur (25) d'entrée de puissance fixé à la puce de semi-conducteur. Le conducteur d'entrée de puissance est caractérisé en ce qu'un premier courant passe à une première température entre la puce de semi-conducteur et le conducteur d'entrée de puissance et qu'un second courant passe à une seconde température entre la puce de semi-conducteur et le conducteur d'entrée de puissance.
front page image
Designated States: AU, BR, CA, CN, JP, KR, MX, SG
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
AU1998064366