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1. (WO1998049367) BISMUTH COATING PROTECTION FOR COPPER
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1998/049367 International Application No.: PCT/US1998/006479
Publication Date: 05.11.1998 International Filing Date: 31.03.1998
Chapter 2 Demand Filed: 27.11.1998
IPC:
C23C 18/31 (2006.01) ,H05K 3/24 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
31
Coating with metals
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
24
Reinforcing of the conductive pattern
Applicants:
FRY'S METALS, INC. [US/US]; 1 Cookson Place Providence, RI 02903, US (AllExceptUS)
MCGRATH, Peter, T. [GB/US]; US (UsOnly)
OWEI, Abayomi, I. [US/US]; US (UsOnly)
Inventors:
MCGRATH, Peter, T.; US
OWEI, Abayomi, I.; US
Agent:
SHAPIRO, Mitchell, W. ; Suite 1701 1100 Wilson Boulevard Arlington, VA 22209, US
Priority Data:
60/045,01028.04.1997US
Title (EN) BISMUTH COATING PROTECTION FOR COPPER
(FR) REVETEMENT DE PROTECTION AU BISMUTH POUR CUIVRE
Abstract:
(EN) Copper-containing surfaces, such as a copper surface for use in an electrical circuit, are protected by the provision of a bismuth metal coating immersion-plated from a moderately to strongly acidic plating bath. The plating bath preferably contains dissolved bismuth, halide, and a sulfur-containing ligand as a complexing agent that promotes adhesion of the bismuth coating. The bath may be formed from a concentrate system combined with water. The concentrate system may be a two-component system having an acidic first component containing the bismuth, halide, and sulfur-containing ligand, and an alkaline second component containing an additional complexing agent (e.g., EDTA salt). Tarnish resistance of the plated bismuth can be improved by the application of an alkaline composition to neutralize residual acid. Plating thickness can be enhanced by pre-cleaning the surface to be plated with a pre-cleaner containing nitric acid.
(FR) Des surfaces à base de cuivre telles que des surfaces en cuivre destinées aux circuits électriques, sont protégées par apport d'un revêtement métallique en bismuth, déposé par immersion dans un bain galvanoplastique modérément à fortement acide. Ledit bain contient de préférence du bismuth dissous, un halogénure et un ligand à base de soufre comme complexant qui favorise l'adhérence du placage de bismuth. On peut former le bain à partir d'un système concentré mélangé avec de l'eau. Ledit système peut être à deux constituants : un premier constituant acide renfermant le bismuth dissous, un halogénure et un ligand à base de soufre, et un second constituant alcalin renfermant un complexant additionnel (par exemple, sel d'EDTA). La résistance au ternissement du bismuth déposé peut être améliorée par application d'une composition alcaline visant à neutraliser l'acide résiduel. On augmente l'épaisseur du placage en nettoyant au préalable la surface à traiter avec un produit de prénettoyage contenant de l'acide nitrique.
Designated States: CN, JP, US
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
US6331201