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1. (WO1998049018) METHOD AND APPARATUS FOR A SUBSTRATE HAVING AN IRREGULAR SHAPE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/1998/049018 International Application No.: PCT/US1998/008230
Publication Date: 05.11.1998 International Filing Date: 24.04.1998
IPC:
B81C 1/00 (2006.01) ,H01L 21/3065 (2006.01) ,H05K 3/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
81
MICRO-STRUCTURAL TECHNOLOGY
C
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
1
Manufacture or treatment of devices or systems in or on a substrate
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
306
Chemical or electrical treatment, e.g. electrolytic etching
3065
Plasma etching; Reactive-ion etching
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
Applicants:
STELLEX MICROWAVE SYSTEMS, INC. [US/US]; 3333 Hillview Avenue Palo Alto, CA 94304, US
Inventors:
MORLEY, Bruce, A.; US
Agent:
TEST, Aldo, J. ; Flehr, Hohbach, Test, Albritton & Herbert LLP Suite 3400 4 Embarcadero Center San Francisco, CA 94111-4187, US
Priority Data:
08/845,81029.04.1997US
Title (EN) METHOD AND APPARATUS FOR A SUBSTRATE HAVING AN IRREGULAR SHAPE
(FR) PROCEDE RELATIF A UN SUBSTRAT DE FORME IRREGULIERE ET APPAREIL CORRESPONDANT
Abstract:
(EN) A method and apparatus for a substrate having an irregular shape is provided. Using a laser, a first series (A) of laser drilled wells (22), having a first spacing (S1) are made in the substrate material (18) to define a substantial portion of the perimeter of the irregular shaped substrate. A second series (B) of laser drilled wells (23) having a second spacing (S2) are made in the substrate material (18) to form the remaining portion of the perimeter of the irregular shaped substrate. The second series of wells form a 'tab' which provides a more rigid tack to the substrate material thereby giving greater adhesion of the substrate to the panel of substrate material, wherein the irregular shaped substrate is retained in the panel without breaking. Upon completion of processing, the irregular shaped substrates are easily removed from the panel. Also provided is an irregular shaped substrate comprising a substrate having a perimeter with at least one rounded corner.
(FR) L'invention a trait à un procédé relatif à un substrat de forme irrégulière et à l'appareil correspondant. On ménage dans le matériau à substrat (18), au moyen d'un laser, une première série (A) de puits (22) séparés par une première distance (S1) et ce, afin de délimiter un partie importante de périmètre du substrat de forme irrégulière. On procède ensuite au forage par laser d'une seconde série (B) de puits (23) de manière à former la partie restante du périmètre du substrat de forme irrégulière. Cette seconde série de puits constitue une 'patte' conférant une meilleure adhérence au matériau à substrat, ce qui renforce l'adhésion du substrat au panneau de matériau à substrat, le substrat de forme irrégulière étant retenu dans le panneau sans rupture. Une fois le traitement achevé, les substrats de forme irrégulière sont aisément retirés du panneau. L'invention concerne également un substrat de forme irrégulière pourvu d'un substrat dont le périmètre possède au moins un coin arrondi.
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Designated States: AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CU, CZ, DE, DK, EE, ES, FI, GB, GE, GH, GM, GW, HU, ID, IL, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, UA, UG, UZ, VN, YU, ZW
African Regional Intellectual Property Organization (ARIPO) (GH, GM, KE, LS, MW, SD, SZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
AU1998071540