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1. WO1998036450 - SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING AND MOUNTING THEREOF, AND CIRCUIT BOARD MOUNTED WITH THE SEMICONDUCTOR DEVICE

Publication Number WO/1998/036450
Publication Date 20.08.1998
International Application No. PCT/JP1998/000338
International Filing Date 28.01.1998
IPC
H01L 21/60 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 23/13 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
13characterised by the shape
H01L 23/31 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
H01L 23/498 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
498Leads on insulating substrates
H05K 3/30 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
CPC
H01L 2224/73204
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73201on the same surface
73203Bump and layer connectors
73204the bump connector being embedded into the layer connector
H01L 23/13
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
13characterised by the shape
H01L 23/3185
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
3157Partial encapsulation or coating
3185the coating covering also the sidewalls of the semiconductor body
H01L 23/49816
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49811Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
49816Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
H01L 24/80
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L 2924/01005
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
01Chemical elements
01005Boron [B]
Applicants
  • SEIKO EPSON CORPORATION [JP]/[JP] (AllExceptUS)
  • HASHIMOTO, Nobuaki [JP]/[JP] (UsOnly)
Inventors
  • HASHIMOTO, Nobuaki
Agents
  • INOUE, Hajime
Priority Data
9/4481113.02.1997JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING AND MOUNTING THEREOF, AND CIRCUIT BOARD MOUNTED WITH THE SEMICONDUCTOR DEVICE
(FR) DISPOSITIF A SEMICONDUCTEUR, SON PROCEDE DE PRODUCTION ET DE MONTAGE, ET PLAQUETTE DE CIRCUIT POURVUE DE CE DISPOSITIF A SEMICONDUCTEUR
Abstract
(EN)
A surface-mounted type semiconductor device which can be easily mounted. The semiconductor device has a semiconductor element (16), an insulating film (12), a wiring pattern (20) which is formed on one face of the insulating film (12) and is connected to the semiconductor element (16), bumps (14) formed on a rear face of the wiring pattern (20) projected on the other face of the insulating film (12) via through holes (12a) in the insulating film (12), and a holding plate (24) which is so pasted on one face of the insulating film (12) as to cover the wiring pattern (20) to keep a flatness with a conductivity. The holding plate (24) is connected to a constant potential section of the wiring pattern (20).
(FR)
L'invention concerne un dispositif à semiconducteur du type monté en surface qui peut être facilement monté. Ce dispositif à semiconducteur comporte un élément semiconducteur (16), un film isolant (12), un réseau d'interconnexion (20) qui est formé sur une face du film isolant (12) et est relié à l'élément semiconducteur (16), des bosses de contact (14) formées sur la face arrière du réseau d'interconnexion (20) faisant saillie sur l'autre face du film isolant (12) en passant par des trous traversants (12a) ménagés dans le film isolant (12), et une plaque de maintien (24) qui est collée sur une face du film isolant (12) de façon à couvrir le réseau d'interconnexion (20) pour donner au dispositif une planéité et une conductivité. La plaque de maintien (24) est connectée à une section de potentiel constant du réseau d'interconnexion (20).
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