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1. WO1998034089 - PRESSURE SENSOR COMPONENT WITH TUBING CONNECTION

Publication Number WO/1998/034089
Publication Date 06.08.1998
International Application No. PCT/DE1998/000187
International Filing Date 21.01.1998
Chapter 2 Demand Filed 04.06.1998
IPC
G01L 9/00 2006.01
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
9Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
G01L 19/14 2006.01
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
19Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
14Housings
CPC
G01L 19/0084
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
19Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
0061Electrical connection means
0084to the outside of the housing
G01L 19/14
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
19Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
14Housings
G01L 19/143
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
19Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
14Housings
142Multiple part housings
143Two part housings
G01L 19/147
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
19Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
14Housings
147Details about the mounting of the sensor to support or covering means
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48247connecting the wire to a bond pad of the item
Applicants
  • SIEMENS AKTIENGESELLSCHAFT [DE]/[DE] (AllExceptUS)
  • WINTERER, Jürgen [DE]/[DE] (UsOnly)
Inventors
  • WINTERER, Jürgen
Priority Data
197 03 206.029.01.1997DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) DRUCKSENSOR-BAUTEIL MIT SCHLAUCHANSCHLUSS
(EN) PRESSURE SENSOR COMPONENT WITH TUBING CONNECTION
(FR) COMPOSANT CAPTEUR DE PRESSION A RACCORD DE TUYAU
Abstract
(DE)
Die Erfindung betrifft ein Drucksensor-Bauteil (1), welches einen Grundkörper (2) und ein Druck-Anschlußstück (8) umfaßt. Der Grundkörper beinhaltet einen Chipträger (3), auf welchen ein Halbleiterchip (4) mit integriertem Drucksensor montiert ist. Der Halbleiterchip ist mit Anschlüssen (5) kontaktiert, die seitlich aus dem Grundkörper herausgeführt sind. Der Grundkörper (2) ist einseitig offen, und die Öffnung (7) wird von Seitenteilen (14) des Chipträgers (3) begrenzt. Auf die oberen Endbereiche (13) der Seitenteile (14) ist das Druck-Anschlußstück (8) aufgesetzt. Die Erfindung zeichnet sich dadurch aus, daß das Füllmittel (6), mit welchem der Innenraum des Grundkörpers (2) befühlt und der Halbleiterchip (4) abgedeckt wird, gleichzeitig zur Verbindung und Abdichtung von Druck-Anschlußstück (8) und Grundkörper (2) verwendet wird. Bevorzugt sind die Enden (12) des Druck-Anschlußstücks (8) so ausgestaltet, daß das Füllmittel (6) durch Kapillarkräfte in den Zwischenraum zwischen Seitenteilen (14) und Druck-Anschlußstück (8) gezogen wird. Besonders bevorzugt ist das Druck-Anschlußstück (8) so ausgestaltet, daß Schläuche unterschiedlichen Durchmessers aufgesetzt werden können.
(EN)
The invention relates to a pressure sensor component (1) comprising a base body (2) and a pressure connecting branch (8). The base body contains a chip carrier (3), on which a semi-conductor chip (4) with integrated pressure sensor is mounted. The semi-conductor chip is contacted with connections (5) which are led laterally through the base body. The base body (2) is open on one side, and the opening (7) is bordered by side sections (14) of the chip carrier (3). The pressure connecting branch (8) is accommodated on the upper ends (13) of the side sections (14). The invention is characterized in that the filler (6), with which the interior space of the base body (2) is filled and the semi-conductor chip (4) is covered, is used simultaneously for connecting and sealing the pressure connecting branch (8) and the base body (2). The ends (12) of the pressure connecting branch (8) are preferably arranged in such a way that the filler (6) is drawn by capillary force into the gap between the side sections (14) and the pressure connecting branch (8). Particularly preferably, the pressure connecting branch (8) is formed in such a way that tubing of different diameters can be placed on it.
(FR)
L'invention concerne un composant capteur de pression (1) comportant un corps de base (2) et un élément de raccordement à la pression (8). Le corps de base renferme un porte-puce (3) sur lequel est montée une puce semi-conductrice (4) à capteur de pression intégré. Cette puce semi-conductrice est en contact avec des connexions (5) qui sortent latéralement du corps de base. Le corps de base est ouvert d'un côté, et l'ouverture (7) est délimitée par des parties latérales (14) du porte-puce (3). L'élément de raccordement à la pression (8) est logé sur les régions terminales supérieures (13) des parties latérales (14). L'invention est caractérisée en ce que la matière de remplissage (6), avec laquelle l'espace intérieur du corps de base (2) est rempli et la puce semi-conductrice (4) est recouverte, sert simultanément à raccorder et étanchéifier l'élément de raccordement à la pression (8) et le corps de base (2). Les extrémités (12) de l'élément de raccordement à la pression (8) sont de préférence configurées de sorte que la matière de remplissage (6) soit aspirée par capillarité dans l'espace intermédiaire entre les parties latérales (14) et l'élément de raccordement à la pression (8). Idéalement, l'élément de raccordement à la pression (8) est configuré de manière à permettre le montage de tuyaux de différents diamètres.
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