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Machine translation
1. (WO1998033365) A CIRCUIT BOARD ASSEMBLY HAVING SURFACE-MOUNT RADIO FREQUENCY COMPONENTS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/1998/033365    International Application No.:    PCT/SE1998/000115
Publication Date: 30.07.1998 International Filing Date: 27.01.1998
Chapter 2 Demand Filed:    07.08.1998    
IPC:
H05K 1/02 (2006.01), H05K 1/11 (2006.01), H05K 3/34 (2006.01)
Applicants: TELEFONAKTIEBOLAGET LM ERICSSON (publ) [SE/SE]; S-126 25 Stockholm (SE)
Inventors: SCHÖÖN, Martin; (SE)
Agent: ERICSSON RADIO SYSTEMS AB; Common Patent Dept., S-164 80 Stockholm (SE)
Priority Data:
08/790,263 28.01.1997 US
Title (EN) A CIRCUIT BOARD ASSEMBLY HAVING SURFACE-MOUNT RADIO FREQUENCY COMPONENTS
(FR) ENSEMBLE CARTE IMPRIMEE POSSEDANT DES COMPOSANTS RADIO FREQUENCE MONTES EN SURFACE
Abstract: front page image
(EN)A circuit board (20) for carrying RF circuitry includes circuit traces (24) with heat-trap portions (36) for creating reflown solder connections between a surface-mount component (26) and surface-mount contacts (30) disposed on the circuit board (20). Wide conductive-traces (34) extend from the surface-mount contacts (30) to interconnect circuit components of the RF circuitry to each other. The heat-trap portions (36) are circular apertures disposed substantially in the middle of the conductive-traces (34) that impede the transfer of heat from the surface-mount contacts (20) through the conductive-tracer (34) during a solder reflow process, without degrading the transmission of the RF energy through the circuit traces (24).
(FR)L'invention concerne une carte imprimée (20) destinée à servir de support à des circuits RF et comprenant des rubans de circuit (24) dotées de portions de rétention de chaleur (36) et permettant de réaliser des connexions brasées par refusion entre un composant (26) monté en surface et des contacts (30) montés en surface sur la carte imprimée (20). De larges pistes rubans conducteurs (34) s'étendent depuis les contacts (30) montés en surface pour interconnecter des composants du circuit RF. Les portions (36) assurant la rétention de chaleur sont des ouvertures circulaires disposées sensiblement au centre des rubans conducteurs (34). Ces portions empêchent que la chaleur émanant des contacts (20) montés en surface ne soit transférée aux rubans conducteurs (34) pendant un processus de refusion de la brasure, sans pour autant nuire à la transmission d'énergie RF par les rubans de circuit (24).
Designated States: AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CU, CZ, DE, DK, EE, ES, FI, GB, GE, GH, GM, GW, HU, ID, IL, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, UA, UG, UZ, VN, YU, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, SD, SZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)