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1. (WO1998033032) METHOD FOR PREPARING HOLLOW MICROCHANNELS AND PRODUCT
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/1998/033032 International Application No.: PCT/US1998/001859
Publication Date: 30.07.1998 International Filing Date: 27.01.1998
Chapter 2 Demand Filed: 27.07.1998
IPC:
B41J 2/02 (2006.01) ,B41J 2/16 (2006.01) ,C25D 1/02 (2006.01) ,F28D 9/00 (2006.01) ,G01N 30/60 (2006.01) ,G01N 35/10 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
41
PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
J
TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2
Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005
characterised by bringing liquid or particles selectively into contact with a printing material
01
Ink jet
015
characterised by the jet generation process
02
generating a continuous ink jet
B PERFORMING OPERATIONS; TRANSPORTING
41
PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
J
TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2
Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005
characterised by bringing liquid or particles selectively into contact with a printing material
01
Ink jet
135
Nozzles
16
Production of nozzles
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
1
Electroforming
02
Tubes; Rings; Hollow bodies
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28
HEAT EXCHANGE IN GENERAL
D
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEAT STORAGE PLANTS OR APPARATUS IN GENERAL
9
Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
30
Investigating or analysing materials by separation into components using adsorption, absorption or similar phenomena or using ion-exchange, e.g. chromatography
02
Column chromatography
60
Construction of the column
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
35
Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/-G01N33/148; Handling materials therefor
10
Devices for transferring samples to, in, or from, the analysis apparatus, e.g. suction devices, injection devices
Applicants: THE UNIVERSITY OF UTAH RESEARCH FOUNDATION[US/US]; Suite 170 421 Wakara Way Salt Lake City, UT 84108, US
Inventors: FRAZIER, Bruno, A.; US
Agent: SEELEY, David, O. ; Workman, Nydegger & Seeley 1000 Eagle Gate Tower 60 East South Temple Salt Lake City, UT 84111, US
Priority Data:
08/789,01327.01.1997US
Title (EN) METHOD FOR PREPARING HOLLOW MICROCHANNELS AND PRODUCT
(FR) PROCEDE POUR PREPARER DES MICROCANAUX CREUX, ET PRODUIT
Abstract:
(EN) The present invention is directed to methods for preparing devices having hollow metallic microchannels (20) on a surface of a planar substrate (10). More specifically, the present invention is directed to methods for preparing devices having surface metallic microchannels with a range of widths and heights selected to provide efficient flow characteristics and having thick and, thus, strong and durable channel walls. In addition, the methods of the present invention are compatible with standard integrated circuit fabrication techniques and, because the microchannels (20) are formed upon the surface of the substrate (10) without degrading the surface planarity, these techniques can be used to incorporate electronic circuitry into the microchannel-containing devices. For purposes of this application, the term 'microchannel' refers to enclosed or partially enclosed channels having heights within the range from about 2 to about 200 micrometers ($g(m)m) and widths within the range of about 10 micrometers to about 2 millimeters.
(FR) L'invention concerne des procédés qui permettent de préparer des dispositifs comportant des microcanaux (20) métalliques creux à la surface d'un substrat plan (10). Plus spécifiquement, elle concerne des procédés qui permettent de préparer des dispositifs comportant des microcanaux métalliques superficiels pour lesquels les plages de largeur et de hauteur sont sélectionnées de façon à donner un régime d'écoulement efficient, et ayant des parois de canaux épaisses et donc résistantes et durables. Ces procédés sont compatibles avec les techniques standards de fabrication de circuits imprimés et, du fait que les microcanaux (20) sont formés à la surface du substrat (10) sans entraîner de dégradation de la planéité de surface, ils peuvent être utilisés pour placer un circuit électronique dans les dispositifs contenant les microcanaux. Dans cette application, le terme de 'microcanal' désigne des canaux fermés ou partiellement fermés dont la hauteur est comprise entre 2 et 200 micromètres environ ($g(m)m) et la largeur entre 10 micromètres et 2 millimètres environ.
front page image
Designated States: AU, CA, JP, KP
European Patent Office (EPO) (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: English (EN)
Filing Language: English (EN)