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1. WO1998016383 - METHOD TO CONTROL CAVITY DIMENSIONS OF FIRED MULTILAYER CIRCUIT BOARDS ON A SUPPORT

Publication Number WO/1998/016383
Publication Date 23.04.1998
International Application No. PCT/US1997/018269
International Filing Date 10.10.1997
Chapter 2 Demand Filed 14.04.1998
IPC
H01L 21/48 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/06-H01L21/326201
H01L 23/13 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
13characterised by the shape
CPC
B32B 2315/02
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2315Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
02Ceramics
B32B 37/0023
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
37Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
0007involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
0023around holes, apertures or channels present in at least one layer
H01L 21/4807
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
4803Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
4807Ceramic parts
H01L 23/13
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
13characterised by the shape
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L 2924/09701
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
095with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
097Glass-ceramics, e.g. devitrified glass
09701Low temperature co-fired ceramic [LTCC]
Applicants
  • SARNOFF CORPORATION [US]/[US]
Inventors
  • SREERAM, Attinganal, Narayanaswamy
  • THALER, Barry, Jay
  • PRABHU, Ashok, N.
Agents
  • SILVERIO, John, V.
Priority Data
08/730,59415.10.1996US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD TO CONTROL CAVITY DIMENSIONS OF FIRED MULTILAYER CIRCUIT BOARDS ON A SUPPORT
(FR) PROCEDE DE CONTROLE DES DIMENSIONS D'UNE CAVITE DE PLAQUETTES DE CIRCUIT A COUCHES MULTIPLES PORTEES EN CUISSON ET POSEES SUR UN SUPPORT
Abstract
(EN)
Patterned laminated green tape multilayer stacks (130) can be fired while maintaining the dimensions of the pattern (120) by applying, as by screen printing or spraying, a ceramic ink (108) over surface portions of the green tape stack. Complex patterns can be formed in the green tapes by punching openings (120) in one or more of the green tape stacks (100) before laminating them together.
(FR)
On peut réaliser la cuisson d'empilements à couches multiples de ruban cru laminé dessiné (130) tout en préservant les dimensions du dessin (120), en appliquant, par sérigraphie ou par pulvérisation, une encre céramique (108) sur des parties de la surface de l'empilement de ruban cru. On peut réaliser des dessins complexes dans les rubans crus en poinçonnant des ouvertures (120) dans un ou plusieurs des empilements de ruban cru (100) avant de les laminer ensemble.
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