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1. WO1998016347 - SEMICONDUCTOR SUBSTRATE POLISHING PAD DRESSER, METHOD OF MANUFACTURING THE SAME, AND CHEMICOMECHANICAL POLISHING METHOD USING THE SAME DRESSER

Publication Number WO/1998/016347
Publication Date 23.04.1998
International Application No. PCT/JP1997/003686
International Filing Date 14.10.1997
Chapter 2 Demand Filed 03.03.1998
IPC
B24B 53/007 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
53Devices or means for dressing or conditioning abrasive surfaces
007Cleaning of grinding wheels
B24B 53/017 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
53Devices or means for dressing or conditioning abrasive surfaces
017Devices or means for dressing, cleaning or otherwise conditioning lapping tools
B24B 53/12 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
53Devices or means for dressing or conditioning abrasive surfaces
12Dressing tools; Holders therefor
B24D 18/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING OR SHARPENING
18Manufacture of grinding tools, e.g. wheels, not otherwise provided for
B24D 3/06 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING OR SHARPENING
3Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
02the constituent being used as bonding agent
04and being essentially inorganic
06metallic
CPC
B24B 53/017
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
53Devices or means for dressing or conditioning abrasive surfaces
017Devices or means for dressing, cleaning or otherwise conditioning lapping tools
B24B 53/12
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
53Devices or means for dressing or conditioning abrasive surfaces
12Dressing tools; Holders therefor
B24D 18/009
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING, OR SHARPENING
18Manufacture of grinding tools ; or other grinding devices; , e.g. wheels, not otherwise provided for
009Tools not otherwise provided for
B24D 3/06
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING, OR SHARPENING
3Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
02the constituent being used as bonding agent
04and being essentially inorganic
06metallic ; or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
Applicants
  • NIPPON STEEL CORPORATION [JP]/[JP] (AllExceptUS)
  • KINOSHITA, Toshiya [JP]/[JP] (UsOnly)
  • TAMURA, Motonori [JP]/[JP] (UsOnly)
Inventors
  • KINOSHITA, Toshiya
  • TAMURA, Motonori
Agents
  • ASAMURA, Kiyoshi
Priority Data
8/27219715.10.1996JP
8/31320925.11.1996JP
9/15625813.06.1997JP
9/15625913.06.1997JP
9/966122.01.1997JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SEMICONDUCTOR SUBSTRATE POLISHING PAD DRESSER, METHOD OF MANUFACTURING THE SAME, AND CHEMICOMECHANICAL POLISHING METHOD USING THE SAME DRESSER
(FR) APPAREIL EBARBEUR POUR TAMPON DE POLISSAGE DE SUBSTRAT SEMI-CONDUCTEUR, SON PROCEDE DE FABRICATION ET PROCEDE DE POLISSAGE CHIMICO-MECANIQUE AU MOYEN DUDIT APPAREIL EBARBEUR
Abstract
(EN)
A semiconductor substrate polishing pad dresser adapted to be brought into sliding contact with a surface to be polished of a semiconductor substrate polishing pad and thereby subject the polishing pad to a conditioning operation, the dresser including a support member having a surface opposed to the polishing pad, a solder alloy material layer covering the surface of the support member, and hard abrasive grains supported in a distributed and buried state on the solder alloy material layer and exposed at a part of each thereof to the outside of the solder alloy material layer. The portions of the surfaces of the hard abrasive grains which contact the solder alloy are coated with a metal carbide layer or a metal nitride layer. The usable solder alloys include Ag alloy and Ag-Cu alloy.
(FR)
L'invention concerne un appareil ébarbeur pour tampon de polissage de substrat semi-conducteur, qui est conçu pour être mis en contact coulissant avec une surface à polir d'un tampon de polissage d'un substrat semi-conducteur, et à soumettre le tampon de polissage à une opération de conditionnement. Ledit appareil rectifieur comprend un élément de support, qui a une surface opposée au tampon de polissage; une couche constituée d'un alliage de soudage, qui recouvre la surface de l'élément de support; et des grains abrasifs durs, qui sont enterrés et répartis dans la couche constituée d'un alliage de soudage mais dont une partie est exposée vers l'extérieur de la couche constituée d'un alliage de soudage. Les parties des surfaces des grains abrasifs durs qui sont au contact de l'alliage de soudage sont revêtues d'une couche de carbure métallique ou d'une couche de nitrure métallique. On peut utiliser notamment comme alliage de soudage un alliage Ag ou un alliage Ag-Cu.
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