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1. WO1998014038 - DEVICE FOR MOUNTING HYBRID CONNECTIONS ON PRINTED CIRCUIT BOARDS

Publication Number WO/1998/014038
Publication Date 02.04.1998
International Application No. PCT/CH1997/000060
International Filing Date 18.02.1997
IPC
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 1/14 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
H05K 3/30 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
H05K 3/36 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
36Assembling printed circuits with other printed circuits
CPC
H01R 12/58
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
50Fixed connections
51for rigid printed circuits or like structures
55characterised by the terminals
58terminals for insertion into holes
H05K 1/0271
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
H05K 1/141
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
H05K 2201/068
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
06Thermal details
068wherein the coefficient of thermal expansion is important
H05K 2201/10318
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10227Other objects, e.g. metallic pieces
1031Surface mounted metallic connector elements
10318Surface mounted metallic pins
H05K 2201/10704
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10613Details of electrical connections of non-printed components, e.g. special leads
10621Components characterised by their electrical contacts
10704Pin grid array [PGA]
Applicants
  • MELCHER AG [CH]/[CH] (AllExceptUS)
  • HUNZIKER, Hansjürg [CH]/[CH] (UsOnly)
Inventors
  • HUNZIKER, Hansjürg
Agents
  • SALGO, Reinhold, C.
Priority Data
2346/9625.09.1996CH
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VORRICHTUNG ZUR MONTAGE VON HYBRIDSCHALTUNGEN AUF LEITERPLATTEN
(EN) DEVICE FOR MOUNTING HYBRID CONNECTIONS ON PRINTED CIRCUIT BOARDS
(FR) DISPOSITIF DE MONTAGE DE CONNEXIONS HYBRIDES SUR DES PLAQUETTES A CIRCUIT IMPRIME
Abstract
(DE)
Die vorliegende Erfindung betrifft eine Vorrichtung zur Montage von elektrischen und elektronischen Bauteilen (17) auf Leiterplatten oder Hybriden (7) mit verschiedener thermischer Ausdehnung. Das Bauteil (17) - beispielsweise aus Aluminium-Oxid-Keramik - trägt als Verbindungs- und Montageelemente mehrere Verbindungsstifte (11). Diese Verbindungsstifte sind beispielsweise stumpf mit einer Leiterbahn (5) des Bauteils (17) verlötet. Jeder Verbindungsstift (11) weist in seinem oberen Teil eine Anzahl Ausnehmungen (15) auf. Durch die Form und Anordnung dieser Ausnehmungen (15) wird erreicht, dass das obere Ende des Verbindungsstifts (11) eine gewisse Bewegungsfreiheit in jeder Richtung des Raums erhält. Auf diese Weise können Differenzen in der thermischen Ausdehnung zwischen Bauteil (17) und Leiterplatte (7) sowie fertigungsbedingte Abweichungen von Sollabmessungen beider Teile ausgeglichen werden. Dadurch können die Verbindungsstifte (11) direkt beispielsweise in durchplattierte Löcher (10) der Leiterplatte (17) eingelötet werden.
(EN)
This invention concerns a device for mounting electrical and electronic components (17) on printed circuit boards or hybrids (7) with different thermal expansion characteristics. The component (17), for instance, out of high-alumina ceramics, has several connecting pins (11) as connecting and mounting elements. These pins are butt-soldered with a conductor path (5) of the component (17). Each connecting pin (11) has a number of recesses (15) in its upper part. The form and arrangement of these recesses (15) effects a certain freedom of movement in all directions for the upper end of the connecting pin (11). This permits compensation for differences in the thermal expansion between component (17) and circuit board (7) and deviations from standard dimensions of both parts resulting from the production. Thus, the connecting pins (11) can be directly soldered into plated throughholes (10) in the circuit board (17).
(FR)
Dispositif de montage de composants électriques et électroniques (17) sur des plaquettes à circuit imprimé ou des éléments hybrides (7) à dilatation thermique différente. Ledit composant (17), par exemple constitué de céramique à base d'oxyde d'aluminium, porte plusieurs broches (11) servant d'éléments de connexion et de montage. Ces broches sont par exemple reliées bout à bout par brasage à une piste conductive (5) du composant (17). Chaque broche de liaison (11) présente dans sa partie supérieure un certain nombre d'évidements (15). La forme et la disposition de ces évidements (15) permettent de conférer à l'extrémité supérieure de la broche de liaison (11) une certaine liberté de mouvement dans toutes les directions spatiales. Il est ainsi possible de compenser les différences de dilatation thermique entre le composant (17) et la plaquette (7) ainsi que les écarts, liés à la fabrication, des dimensions théoriques des deux parties. Lesdites broches (11) peuvent donc être soudées directement par brasage, par exemple dans des trous (10) métallisés de la plaquette (17).
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